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Saturday, December 3, 2016

3Q 2016: NAND Flash suppliers market share: Samsung 36.6%, Toshiba 19.8%, Western Digital 17.1%





Global NAND Flash Revenue Rose 19.6% Sequentially in Third Quarter as Demand Outpaced Supply, According to TrendForce.

Prices of NAND Flash rose in the third quarter as smartphone makers continued to generate robust demand for related products and the technological transition from 2D-NAND to 3-NAND manufacturing reduced the industry’s overall output. The latest report from DRAMeXchange, a division of TrendForce, finds that the revenue of the global NAND Flash industry grew 19.6% sequentially in the third quarter. 

At the same time, NAND Flash suppliers made larger gains in respective their operating margins compared with the prior quarter.

“The NAND Flash market outlook for the fourth quarter of 2016 indicates that NAND Flash supply will be under greater strain with the advent of the peak shipment season season for end devices,” said Sean Yang, research director of DRAMeXchange. 

“Therefore, contract prices for various NAND Flash products will see larger increases, which in turn will take suppliers’ revenues and operating margins to new highs for this year.”

Samsung
Samsung retained its first place position in the quarterly revenue ranking as the company benefited from strong demand from Chinese smartphone brands for high-capacity eMMC and UFS products. Among the suppliers, Samsung currently has the largest global market shares for high-capacity eMMC and UFS products. 

The company is also the leader in the global eMCP market. At the same time, Samsung shipments of enterprise-grade SSDs have expanded as the supplier’s solutions offer better bargain for customers.Samsung’s third-quarter NAND Flash bit shipments increased by 20% compared with the prior quarter. 

The supplier’s quarterly revenue from NAND Flash sales for the same period advanced about 20% sequentially.Samsung’s revenue outlook for this fourth quarter is expected to be even better than the third. Demands for eMMC, UFS and eMCP products will be at their annual peaks on account of the seasonal increase in smartphone shipments. Moreover, Samsung will continue to enlarge its market shares for client- and enterprise-grade SSDs.

SK Hynix
During the third quarter, SK Hynix also enjoyed strong demand from Chinese smartphone brands for eMMC and eMCP as well as stock-up activities related to releases of new smartphones. Compared with the second quarter, SK Hynix posted a 12% increase in its NAND Flash bit shipments and a 7% increase in the average selling price (ASP) of its NAND Flash chips. As a result, SK Hynix’s third-quarter NAND Flash revenue rose 20.3% sequentially to around US$1.06 billion.

In terms of product planning, SK Hynix will be able to boost its 3D-NAND production capacity to around 20,000~30,000 wafers per month before the end of 2016. The supplier will commence shipments of its third-generation 3D-NAND Flash in the first quarter of 2017. The supplier’s fourth-generation NAND Flash may also be ready for small-batch runs by the second half of next year.

Toshiba
Results from Toshiba’s NAND Flash business from July to September (or the company’s fiscal second quarter for 2016) showed that the upturn in the NAND Flash market caused the supplier’s bit shipments to grow by 15% compared with the previous three-month period. Moreover, there was a moderation in the decline of the supplier’s NAND Flash ASP. On the whole, Toshiba’s NAND Flash revenue for its fiscal second quarter rose about 17% sequentially. The supplier also saw increase in its operating margin, reflecting a steady improvement in its NAND Flash business.

With regard to production planning, Toshiba’s newly rebuilt facility Fab 2 at Yokkaichi (in Mie Prefecture, Japan) has been assigned to produce 3D-NAND Flash and is expected to achieve a capacity of 40,000 wafers per month during this calendar fourth quarter (October to December 2016). 

The capacity of Fab 2 will expand again 2017 when the facility is scheduled to begin mass production of its 64-layer 3D-NAND Flash. Toshiba will also begin the construction of a new facility Fab 6 in February of 2017.

Western Digital
The calendar third quarter of 2016 was Western Digital’s first quarter for the company’s fiscal year of 2017. During this period, the supplier focus its investment on 64-layer 3D-NAND Flash. 

The product is now being tested by OEM customers and is expected to be available for memory cards, USB drives and other removable storage devices at the start of this December. Meanwhile, the supplier is already mass producing products carrying its 48-layer 3D-NAND Flash. These items include eMMC, eMCP and other mobile and removable storage products.

Western Digital’s 2D-NAND Flash is mainly produced on the 15nm process and the supplier has done its utmost to optimize costs and maximize yield for the technology. Hence, the 15nm 2D-NAND Flash remains a major contributor to Western Digital’s revenue growth. Furthermore, Western Digital’s annual bit output for NAND Flash is forecast to increase by 45% in 2017.

Micron
In its fiscal fourth quarter for 2016 (from June to August), Micron posted a 13% sequential increase in its NAND Flash bit shipments and a 1% drop in its NAND Flash ASP. Consequently, Micron’s revenue from non-volatile memory for its fiscal fourth quarter rose by 10% compared with the prior fiscal quarter to UD$1 billion.

The breakdown of Micron’s revenue also shows that the share of component base in the total sales declined slightly to 50%, while the revenue share of mobile NAND Flash product grew a little to 18%. SSD’s share in the quarterly non-volatile revenue was 13%. Automotive and other products represented about 19%.

Micron’s mobile products based on the 3D-NAND architecture have been received favorably by customers. The supplier has also begun to ship client-grade SSDs carrying 3D-NAND Flash. In the market for enterprise-grade SSDs, Micron’s bit shipments from June to August rose 45% compared with the prior three-month period. 

Micron is expected to make significant improvements in the cost structure of its SSD portfolio when its TLC 3D-NAND memory accounts for the majority portion of its Flash output.

Intel
Between the second and third quarter of 2016, Intel’s NAND Flash business saw bit shipments expanded by 25% and revenue grew by 17% to U$649 million, thereby ending three consecutive quarters of sequential decline.

While 2D-NAND chips made on the 16nm and 20nm processes still make up the largest share of Intel’s NAND Flash-related product mix, the supplier has begun shipments of its 3D-NAND enterprise-grade SSDs since the third quarter. 

Intel’s current 3D-NAND enterprise-grade SSDs are considered better than the prior-generation counterparts in terms of cost to performance. As for production planning, Intel’s NAND Flash fab in Dalian, China is expected to achieve 10,000 wafers per month this fourth quarter. The facility’s capacity will continue to expand gradually on a quarterly basis in 2017.



Thursday, December 1, 2016

See 5 New Inventions



The inventions you can watch on the video below are:


Inventions:

1. iKeybo: World's Most Advanced Projection Keyboard and Piano. The world’s first virtual laser projection multilingual keyboard, virtual piano, and portable charger. All Together.

2. BumpOut: The Truly Portable Speaker that Bumps. Innovative Motorized Expansion Technology. 

Powerful, high quality sound that fits in your pocket.
 
3. Xcape: Folding E-Scooter for Smart Urban Commuting. Goes 15 mph. Folds up in ONE second and fits anywhere. The green way to commute with ease and FUN! 

4. Levitation: World's First Bionic Knee Brace by Spring Loaded. We wanted to make something that would change people's lives in a big way. 

5. Airflow: World's First Airflow Audio Wireless Headphones. Airflow audio delivers sound detail that will change the way you experience music.




Taiwan: Asustek plans to officially launch Zenbo robots in late 2016.



Asustek Computer has officially kicked off its Zenbo robot developer program with the release of the Zenbo software development kit (SDK) and Zenbo developer tools, according to the company.

With the Zenbo SDK, developers can control many of Zenbo's capabilities, including active mobility, 3D vision detection, facial expressions, gestures, and verbal communication, to create their own apps.

The Zenbo SDK consists of DDE Editor, App Builder, and Story Editor. DDE Editor helps developers design and test their apps, and also serves as a platform for publishing app dialog scripts. 

App Builder's visual programming logic interface improves application development efficiency as well as letting developers easily control Zenbo's actions, expressions, sensors, and other functions.

The Story Editor provides a software framework and timeline based interface that enables developers to create and edit stories for Zenbo.

Asustek plans to officially launch Zenbo robots in the Taiwan market before year-end 2016.


Foxconn to ship 60.000 Pepper robots.






Foxconn Electronics is expected to ship a total of 60,000 Pepper robots from its plant in Shandong, China in 2016, valued at US$500 million, according to a Chinese-language Commercial Times report.

The Shandong plant is currently rolling out 2,000 Pepper robots a month and is shipping the robots to the US and Europe, in addition to the initial markets in Japan and Taiwan.

The Pepper is developed by Japan-based SoftBank Robotics Holdings (SBRH), of which Foxconn and the Alibaba Group have a 20% stake each.

In addition to the Pepper robots, Foxconn has also begun volume production of a toddler-care mini robot, the ibotn, which is developed by Taiwan ShouDe International Electronics.

Production of the ibotn robots will reach 5,000 units a month by the second quarter of 2017.


Apple reducing orders for the iPhone 7.




Information coming from Taiwan is saying Apple is reducing orders of the iPhone 7 since sales are fading.

The strong demand momentum of the device is just finished It was in part for the black and jet black colors and the mishap brought upon by Samsung Galaxy Note 7.

Market rumors have indicated that the next generation iPhone will come with OLED displays, glass cases, dual-lens cameras, enhanced CPUs, and advanced sensors, while supporting mixed reality (MR) and wireless charging technologies.

Affected by consumers' high expectations on the next generation iPhone, makers in the supply chain are mostly conservative about the shipment outlook for the iPhone 7 in the first half of 2017, expecting shipments in this six-month period to be at least five million units less than those shipped in the second half of 2016.  

Demand for the iPhone 7 devices in China and other markets has scaled down significantly since their launch less than three months ago.




Wednesday, November 30, 2016

Nokia and Hewlett Packard Enterprise expand collaboration on IoT solutions.




Nokia and Hewlett Packard Enterprise expand collaboration on Enterprise of Things.
  • Companies will focus on IoT solutions for smart city and industrial/manufacturing customers, with initial offerings planned for early 2017
  • Partnership strengthens portfolios of both companies and go-to-market capabilities in market forecast to reach 161 billion USD by 20201
  • Current partnership includes deals with more than 25 service provider and enterprise customers

Espoo, Finland and Palo Alto, Calif. - Nokia and Hewlett-Packard Enterprise (HPE) today announced a strategic collaboration on Internet of Things (IoT) solutions for enterprise customers.

The companies will jointly market and sell solutions for two IoT vertical enterprise segments, including industrial/manufacturing and smart city applications. They will provide industrial/manufacturing customers with solutions for asset management, smart manufacturing, remote site automation and predictive maintenance, and enhanced networking choices for improved connectivity for smart city solutions, such as smart lighting and smart buildings.

According to research firm Markets and Markets, the IoT market for smart cities and manufacturing will reach USD 161 billion by 2020. The markets will grow as manufacturing companies use IoT to improve productivity in the production process and the supply chain, and as cities with growing populations use IoT to improve operational efficiency, maintain and protect their infrastructure, and operate in a sustainable manner.

The joint offerings combine connectivity, core networking, data aggregation and compute technologies from Nokia and HPE. The companies are currently working on a proof-of-concept for smart cities, combining Nokia's routing capabilities with HPE's Hybrid IT capabilities for joint project delivery models.

The IoT partnership extends the existing collaboration between the two organizations, which to date includes end-to-end deals with 25 enterprise and service provider customers, and more than 30 proof-of-concepts.

Kathrin Buvac, chief strategy officer at Nokia, said: "We are pleased to extend our partnership with HPE into the IoT space. HPE's market presence offers Nokia expedited and increased access to the enterprise market and target verticals along with a complimentary portfolio of products and services."

Antonio Neri, executive vice president, Head of Enterprise Group at HPE, said: "The addition of Nokia to the HPE IoT partner ecosystem will bring broader choice and market-leading technologies to our joint customers. HPE and Nokia have a long history of innovation that will help our customers through their journey of digitization."

HPE has joined Nokia's IoT Community (www.iotcommunity.com), an ecosystem of innovative companies collaborating on solution concepts, end-to-end prototypes, business models and market trials that will unleash the full potential of IoT. Nokia is joining part of HPE's IoT initiative within HPE's industry leading Partner Ready program.

The joint solutions will be ready to market from early 2017 onwards.

About Hewlett Packard Enterprise
Hewlett Packard Enterprise is an industry leading technology company that enables customers to go further, faster. With the industry's most comprehensive portfolio, spanning the cloud to the datacenter to workplace applications, our technology and services help customers around the world make IT more efficient, more productive and more secure. 

About Nokia
Nokia is a global leader in creating the technologies at the heart of our connected world. Powered by the research and innovation of Nokia Bell Labs, we serve communications service providers, governments, large enterprises and consumers, with the industry's most complete, end-to-end portfolio of products, services and licensing.

From the enabling infrastructure for 5G and the Internet of Things, to emerging applications in virtual reality and digital health, we are shaping the future of technology to transform the human experience. www.nokia.com

Media Enquiries:
HPE
Jyotsna Grover
+1 650-857-1501 
Jyotsna.grover@hpe.com
Nokia
Communications
+358 (0) 10 448 4900
press.services@nokia.com

Tuesday, November 29, 2016

USA: The Samsung Galaxy J7 Prime 2016 DUAL SIM - Factory Unlocked Phone - (Black) is now available.




Samsung Galaxy J7 Prime (M-G610M/DS) DUAL SIM - Factory Unlocked Phone - (Black)


Some specifications:
Runs  Exynos 7870 SoC and sports a 5.5-inch HD display. RAM is 3GB, while internal memory options include 16GB and 32GB. In terms of camera, the handset offers a 13MP rear unit and an 8MP front shooter. It runs Android 6.0.1, packs in a 3,300mAh battery, and features a fingerprint sensor 
 This model has a  16GB internal memory:



Full specifications: (Thanks to gsmarena)