Showing posts with label Intel. Show all posts
Showing posts with label Intel. Show all posts

Friday, June 12, 2020

Intel launches Lakefield Intel core processors with 5 cores for foldables, dual screens and PC form factors. Video.

https://www.youtube.com/watch?v=H9-pNciBIGk&feature=em-uploademail


Intel Hybrid Processors: Uncompromised PC Experiences for Innovative Form Factors Like Foldables, Dual Screens.

What’s New: Today, Intel launched Intel® Core™ processors with Intel® Hybrid Technology, code-named “Lakefield.” Leveraging Intel’s Foveros 3D packaging technology and featuring a hybrid CPU architecture for power and performance scalability, Lakefield processors are the smallest to deliver Intel Core performance and full Windows compatibility across productivity and content creation experiences for ultra-light and innovative form factors.

“Intel Core processors with Intel Hybrid Technology are the touchstone of Intel’s vision for advancing the PC industry by taking an experience-based approach to designing silicon with a unique combination of architectures and IPs. Combined with Intel’s deepened co-engineering with our partners, these processors unlock the potential for innovative device categories of the future.”
–Chris Walker, Intel corporate vice president and general manager of Mobile Client Platforms

Why They’re Great for Innovative PC Form Factors: Intel Core processors with Intel Hybrid Technology deliver full Windows 10 application compatibility in up to a 56% smaller package area for up to 47% smaller board size1 and extended battery life, providing OEMs more flexibility in form factor design across single, dual and foldable screen devices while delivering the PC experiences people expect. They are also:

  • The first Intel Core processors shipping with attached package-on-package (PoP) memory, further reducing board size.
  • The first Intel Core processors to deliver as low as 2.5mW of standby SoC power – an up to 91% reduction compared to Y-series processors – for more time between charges2.
  • The first Intel processors to feature native dual internal display pipes, making them ideally suited for foldable and dual-screen PCs.

When You Can Get It: Two announced designs powered by the Intel Core processors with Intel Hybrid Technology and co-engineered with Intel include the Lenovo ThinkPad X1 Fold, the first fully functional PC with a folding OLED display unveiled at CES 2020 and expected to ship this year, and the Intel-based Samsung Galaxy Book S expected in select markets starting in June.

About Key Features & Capabilities: Intel Core i5 and i3 processors with Intel Hybrid Technology leverage a 10nm Sunny Cove core to take on more intense workloads and foreground applications, while four power-efficient Tremont cores balance power and performance optimization for background tasks. The processors are fully compatible with 32- and 64-bit Windows applications, helping reach new heights for the thinnest and lightest designs.

  • Smallest package size, enabled by Foveros: With Foveros 3D stacking technology, processors achieve a dramatic reduction in package area – now only a miniscule 12x12x1 mm, approximately the size of a dime – by stacking two logic dies and two layers of DRAM in three dimensions, also eliminating the need for external memory.
  • Hardware-guided OS scheduling: Enabling real-time communication between the CPU and the OS scheduler to run the right apps on the right cores, the hybrid CPU architecture helps deliver up to 24% better performance per SOC power3 and up to 12% faster single-threaded integer compute-intensive application performance4.
  • More than 2x throughput on Intel UHD for AI-enhanced workloads5: Flexible GPU engine compute enables sustained, high-throughput inference applications – including AI-enhanced video stylization, analytics and image resolution upscaling.
  • Up to 1.7x better graphics performance6: Gen11 graphics delivers seamless media and content creation on the go – the biggest leap in graphics for Intel processor-based 7-watt systems. Convert video clips up to 54% faster7, and with support for up to four external 4K displays, immerse in rich visuals for content creation and entertainment.
  • Gigabit connectivity: With support for Intel® Wi-Fi 6 (Gig+) and Intel LTE solutions, experience seamless video conferencing and streaming online.

 

Processor NumberGraphicsCores / ThreadsGraphics (EUs)CacheTDPBase Freq (GHz)Max Single Core Turbo (GHz)Max All Core Turbo (GHz)Graphics Max Freq (GHz)Memory
i5-L16G7Intel UHD Graphics5/5644MB7W1.43.01.8Up to 0.5LPDDR4X-4267
i3-L13G4Intel UHD Graphics5/5484MB7W0.82.81.3Up to 0.5LPDDR4X-4267

 

More ContextLakefield Press Kit | Lakefield Product Brief | Press Deck | Intel Images: Up Close with Lakefield

Samsung Galaxy A50 US Version Factory Unlocked Cell Phone with 64GB Memory, 6.4" Screen, Black, [SM-A505UZKNXAA] US$299.99


The Small Print:

Performance results are based on testing as of dates shown in configuration and may not reflect all publicly available updates. See configuration disclosure for details. No product or component can be absolutely secure.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit www.intel.com/benchmarks.

Your costs and results may vary.

Intel technologies may require enabled hardware, software or service activation.

Intel contributes to the development of benchmarks by participating in, sponsoring, and/or contributing technical support to various benchmarking groups, including the BenchmarkXPRT Development Community administered by Principled Technologies.

1 Up to 56% smaller package area and up to 47% smaller board size: Intel® Core™ i5-L16G7 compared to Intel® Core™ i7 8500Y processor

2 Up to 91% reduction in standby power: Intel® Core™ i5-L16G7 compared to Intel® Core™ i7-8500Y

3 Up to 24% better web browsing power efficiency: As measured by WebXPRT3 score per Watt on Intel® Core™ i5-L16G7 vs. Intel® Core™ i7-8500Y

4 Up to 12% faster single threaded integer compute intensive application performance: As measured by SPEC CPU2006 on Intel® Core™ i5-L16G7 vs. Intel® Core™ i7-8500Y

5 2x throughput on Intel UHD graphics for AI-Enhanced Workloads: As measured by MLPerf v0.5 Inference with Offline Scenario using OpenVINO 2020.R2 framework Closed ResNet50-v1.5 offline FP16 GPU (Batch=128) workload on Intel® Core™ i5-L16G7 versus Intel® Core™ i7-8500Y

6 Up to 1.7x better graphics performance: As measured by 3DMark 11 on Intel® Core™ i5-L16G7 vs. Intel® Core™ i7-8500Y

7 Up to 54% faster at converting video clips to your favorite format: as measured by Handbrake RUG 1213 on Intel® Core™ i5-L16G7 vs. Intel® Core™ i5-8200Y

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Friday, October 25, 2019

Intel introduces Tremont microarchitecture. Video.




What’s New: Today at the Linley Fall Processor Conference in Santa Clara, Calif., Intel revealed the first architectural details related to Tremont. Intel’s newest and most advanced low-power x86 CPU architecture, Tremont offers a significant performance boost over prior generations.
“Tremont is Intel’s most advanced low-power x86 architecture to date. We focused on a range of modern, complex workloads, while considering networking, client, browser and battery so that we could raise performance efficiently across the board. It is a world-class CPU architecture designed for enhanced processing power in compact, low-power packages.”
–Stephen Robinson, Intel Tremont Chief Architect
Why It Matters: Tremont next-generation low-power x86 microarchitecture delivers significant IPC (instructions per cycle) gains gen-over-gen compared with Intel’s prior low-power x86 architectures. Designed for enhanced processing power in compact, low-power packages, Tremont-based processors will enable a new generation of innovative form factors for client devices, creative applications for the internet of things (IoT), efficient data center products and more.
When combined with other technologies across Intel’s broader IP portfolio, this architecture will enable a new generation of products. Using Intel’s 3D packaging technology Foveros, Tremont is integrated within a wider set of silicon IPs in Lakefield, which will power breakthrough innovative devices like the recently announced dual-screen Microsoft Surface Neo.
Performant architectures are the foundation of chips that capture and process data. Low-power solutions are essential to enabling new use cases driven by smaller form factors.
The Details: Intel Tremont includes several advancements in ISA (instruction set architecture), microarchitecture, security and power management. It delivers significant IPC gains gen-over-gen as compared with Intel’s prior low-power x86 architectures, making it a first-class offering for powering a new generation of Intel products across client, IoT and data center offerings. Tremont’s unique 6-wide (2×3-wide clustered) out-of-order decoder in the front end allows for a more efficient feed to the wider back end, which is fundamental for performance.
For more complete information about performance and benchmark results, visit Intel’s Performance Benchmark page.
  • Intel Tremont 1
    Intel Corporation in October 2019 introduced its Tremont microarchitecture. Intel Tremont advances instruction set architecture, microarchitecture, security and power management. Tremont is designed for enhanced processing power in compact, low-power packages. Tremont-based processors will enable a new generation of innovative form factors. (Credit: Intel Corporation)

Wednesday, August 21, 2019

Intel announced Intel Core 10th Gen i3, i5, i7 Processors .-



Intel Expands 10th Gen Intel Core Mobile Processor Family, Offering Double Digit Performance Gains



Intel Corporation in August 2019 introduced eight 10th Gen Intel Core processors for modern laptop computing. The new mobile PC processors (formerly code-named “Comet Lake”) are tailor-made to deliver increased productivity and performance scaling for demanding, multithreaded workloads while still enabling thin-and-light laptop and 2 in 1 designs. (Credit: Intel Corporation)

What’s New: Today, Intel introduced eight additional 10th Gen Intel® Core™ processors for modern laptop computing. The new mobile PC processors (formerly code-named “Comet Lake”) are tailor-made to deliver increased productivity and performance scaling for demanding, multithreaded workloads while still enabling thin-and-light laptop and 2 in 1 designs with uncompromising battery life1.
These processors are performance powerhouses that bring double digit performance gains compared with the previous generation2. The lineup also includes Intel’s first 6-core processor in the U-series, faster CPU frequencies, faster memory interfaces and the industry redefining connectivity with Intel® Wi-Fi 6 (Gig+) and broader scaling of Thunderbolt™ 3. More than 90 additional designs based on the 10th Gen Intel Core processor family will hit the shelves for the holiday season.
“Our 10th Gen Intel Core mobile processors provide customers with the industry-leading range of products that deliver the best balance of performance, features, power and design for their specific needs. From multitasking to everyday content creation, the newest additions to the family scale performance for even higher levels of productivity — in addition to offering best-in-class platform connectivity via Wi-Fi 6 (Gig+) and Thunderbolt 3 that people expect with 10th Gen.”
–Chris Walker, Intel corporate vice president and general manager of Mobility Client Platforms in the Client Computing Group
Why It Matters: Taking advantage of Intel’s world-class portfolio of technologies and intellectual property, the 10th Gen Intel Core processor family delivers a range of workload-optimized platforms to address diverse computing needs and experiences. The new 10th Gen Intel Core processors leverage the improvements in intra-node optimizations on Intel’s highly optimized 14nm process technology that enable up to 16% overall performance gains2 and over 41% better productivity and multitasking on Microsoft Office 365* compared with the previous generation3 — all without compromising battery life1. Additionally, they integrate the best wireless connectivity with Intel WiFi6 (Gig+)4 and support Thunderbolt 3, the fastest and most versatile port available5.

Earlier this month, Intel launched the first products in 10th Gen Intel Core processor family, which were developed on the 10nm process technology and focus on bringing high-performance artificial intelligence (AI) to the PC at scale, a big leap forward in graphics performance and best-in-class connectivity. The new processors introduced today share the same leading platform connectivity, while expanding the family with processors for scaling performance and frequencies for modern productivity workloads. The result is a complete family of processors that complement each other, giving people choices for what usages matter most to them and re-imagining the possibilities of a modern laptop experience.
What They Feature:
The new 10th Gen Intel Core processors range from Intel Core i3 to Intel Core i7 and feature:
  • Up to 6 cores and 12 threads
  • Up to 4.9 GHz max turbo frequency
  • Up to 12MB Intel Smart Cache
  • Configurable up to 25W for maximum performance (U-series)
  • Configurable down to 4.5W for 4-core fanless designs (Y-series)
  • Up to 1.15 GHz graphics frequency
  • LPDDR4x, LPDDR3, DDR4 memory speed increase to 2666 MT/s
People can also expect the same great connectivity across the entire 10th Gen Intel Core processor family. Integrated Intel Wi-Fi 6 (Gig+) brings enhanced WPA3 security for additional peace of mind and is nearly 3 times faster6 to enable quick file downloads and more responsive performance throughout the home. Systems with these processors also support Thunderbolt 3 controllers enabling up to four Thunderbolt 3 ports, each capable of delivering power, download speeds of 40 Gb/s and connecting to the thousands of docks, displays and peripherals in the market, all via a single cable.
Finally, the new processors scale the number of designs optimized with Intel® Adaptix™ Technology, supporting modern standby for faster wake and enabling multiple voice assistant services built into the PCs. Within Intel Adaptix Technology, Intel® Dynamic Tuning Technology enables OEM partners to tune 10th Gen Intel Core processor-based systems to achieve even more performance — ranging from 8% to 12% on a typical system7. On select designs, Intel Dynamic Tuning Technology now offers the first ever AI-based pre-trained algorithms to predict workloads and allow higher turbo burst when responsiveness is needed and extended time in turbo for sustained workloads.
How to Get Them: Laptops and 2 in 1s powered by the new 10th Gen Intel Core processors will be available from PC manufacturers for the holiday season. Select systems from PC manufacturers based on 10th Gen Intel Core processors are on track for verification through Intel’s innovation program code-named “Project Athena.” Look for the “Engineered for Mobile Performance” signage online and in retail stores this fall for the best of 10th Gen Intel Core processor-based systems from PC manufacturers.
The Details:
Processor NumberIA Cores/ ThreadsGraphics (EUs)CacheNominal TDP/
Config UP TDP
Base Freq (GHz)Max Single
Core Turbo (GHz)
Max All Core Turbo (GHz)Graphics
Max Freq (GHz)
Memory
Support
Intel® Core™ i7-10710U6/122412MB15W/25W1.14.73.91.15LPDDR4x 2933
LPDDR3 2133
DDR4 2666
U-Series
Intel® Core™ i7-10510U4/8248MB15W/25W1.84.94.31.15LPDDR4x 2933
LPDDR3 2133
DDR4 2666
Intel® Core™ i5-10210U4/8246MB15W/25W1.64.23.91.10LPDDR4x 2933
LPDDR3 2133
DDR4 2666
Intel® Core™ i3-10110U2/4234MB15W/25W2.14.13.71.00LPDDR4x 2933
LPDDR3 2133
DDR4 2666
Processor NumberIA Cores/ ThreadsGraphics
(EUs)
CacheConfig Down TDP/
Nominal TDP/
Config UP TDP
Base Freq (GHz)Max Single
Core Turbo
(GHz)
Max All Core Turbo
(GHz)
Graphics Max Freq
(GHz)
Memory
Support
Y-SeriesIntel® Core™ i7-10510Y4/8248MB4.5W/7W/9W1.24.53.21.15LPDDR3 2133
Intel® Core™ i5-10310Y4/8246MB5.5W/7W/9W1.14.12.81.05LPDDR3 2133
Intel® Core™ i5-10210Y4/8246MB4.5W/7W/9W1.04.02.71.05LPDDR3 2133
Intel® Core™ i3-10110Y2/4244MB5.5W/7W/9W1.04.03.71.00LPDDR3 2133
The Small Print:
Intel, Core, Optane, Thunderbolt and the Intel logo are trademarks of Intel Corporation in the United States and/or other countries.
Performance results are based on testing as of dates shown in configuration and may not reflect all publicly available security updates. See configuration disclosure for details. No product or component can be absolutely secure.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit www.intel.com/benchmarks.
Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on system configuration. Check with your system manufacturer or retailer or learn more at intel.com.
Results have been estimated or simulated using internal Intel analysis or architecture simulation or modeling, and provided to you for informational purposes. Any differences in your system hardware, software or configuration may affect your actual performance.
1Battery Life estimated based on measurements of average power on an Intel reference platform for a local video playback of a 1080p 24fps h.264 7Mbps 12min 14 sec content using the Windows Movie & TV App.  Intel Preproduction Processor: Intel® Core™ i7 -10710U (CML-U 6+2) PL1=15W, 6C12T, Turbo up to 4.7GHz, Memory: 2x16GB DDR4-2667 2Rx8, Storage: Intel® 760p M.2 PCIe NVMe SSD with AHCI Microsoft driver, Display Resolution: 3840×2160 eDP Panel 12.5”, OS: Windows* 10 19H1-18362.ent.rx64-Appx59. Power policy set to AC/Balanced mode for all benchmarks except SYSmark 2014 SE which is measured in AC/BAPCo mode for Performance. Power policy set to DC/Balanced mode for power with UX Slider set to Better Performance. All benchmarks run in Admin mode & Tamper Protection Disabled / Defender Disabled, Graphics driver: PROD-HC-RELEASES-GFX-DRIVER-CI-MASTER-2334-REVENUE-PR-1006952-WHQL. vs Intel® Core™ i7-8565U PL1=15W, 4C8T, Memory: 2x16GB DDR4-2667 2Rx8, Storage: Intel® 760p M.2 PCIe NVMe SSD with AHCI Microsoft driver, Display Resolution: 3840×2160 eDP Panel 12.5”, OS: Windows* 10 19H1-18362.ent.rx64-Appx59. Power policy set to AC/Balanced mode for all benchmarks except SYSmark 2014 SE which is measured in AC/BAPCo mode for Performance. Power policy set to DC/Balanced mode for power. All benchmarks run in Admin mode & Tamper Protection Disabled / Defender Disabled, Graphics driver: 2019-1006577-WHQL.
2As measured by SYSmark2018 Overall Score. Intel Preproduction Processor: Intel® Core™ i7 -10710U (CML-U 6+2) PL1=25W, 6C12T, Turbo up to 4.7GHz, Memory: 2x16GB DDR4-2667 2Rx8, Storage: Intel® 760p M.2 PCIe NVMe SSD with AHCI Microsoft driver, Display Resolution: 3840×2160 eDP Panel 12.5”, OS: Windows* 10 19H1-18362.ent.rx64-Appx59. Power policy set to AC/Balanced mode for all benchmarks except SYSmark 2014 SE which is measured in AC/BAPCo mode for Performance. Power policy set to DC/Balanced mode for power. All benchmarks run in Admin mode & Tamper Protection Disabled / Defender Disabled, Graphics driver: PROD-HC-RELEASES-GFX-DRIVER-CI-MASTER-2334-REVENUE-PR-1006952-WHQl. vs Processor: Intel® Core™ i7-8565U (WHL-U4+2) PL1=15W TDP, 4C8T, Turbo up to 4.6GHz, Memory: 2x16GB DDR4-2400 2Rx8, Storage: Intel® 760p m.2 PCIe NVMe SSD with AHCI Microsoft driver, Display Resolution: 3840×2160 eDP Panel 12.5”, OS: Windows* 10 19H1-18362.ent.rx64-Appx59. Power policy set to AC/Balanced mode for all benchmarks except SYSmark 2014 SE which is measured in AC/BAPCo mode for Performance. Power policy set to DC/Balanced mode for power with UX Slider set to Better Performance. All benchmarks run in Admin mode & Tamper Protection Disabled / Defender Disabled, Graphics driver: 2019-1006577-WHQL.
3As measured by the time it takes Microsoft Office to perform 3 tasks in a multitasking scenario (export PowerPoint file to video, export word doc to pdf and excel calculation). Intel Preproduction Processor: Intel® Core™ i7 -10710U (CML-U 6+2) PL1=25W, 6C12T, Turbo up to 4.7GHz, Memory: 2x16GB DDR4-2667 2Rx8, Storage: Intel® 760p M.2 PCIe NVMe SSD with AHCI Microsoft driver, Display Resolution: 3840×2160 eDP Panel 12.5”, OS: Windows* 10 19H1-18362.ent.rx64-Appx59. Power policy set to AC/Balanced mode for all benchmarks except SYSmark 2014 SE which is measured in AC/BAPCo mode for Performance. Power policy set to DC/Balanced mode for power. All benchmarks run in Admin mode & Tamper Protection Disabled / Defender Disabled, Graphics driver: PROD-HC-RELEASES-GFX-DRIVER-CI-MASTER-2334-REVENUE-PR-1006952-WHQl. vs Processor: Intel® Core™ i7-8565U (WHL-U4+2) PL1=15W TDP, 4C8T, Turbo up to 4.6GHz, Memory: 2x16GB DDR4-2400 2Rx8, Storage: Intel® 760p m.2 PCIe NVMe SSD with AHCI Microsoft driver, Display Resolution: 3840×2160 eDP Panel 12.5”, OS: Windows* 10 19H1-18362.ent.rx64-Appx59. Power policy set to AC/Balanced mode for all benchmarks except SYSmark 2014 SE which is measured in AC/BAPCo mode for Performance. Power policy set to DC/Balanced mode for power with UX Slider set to Better Performance. All benchmarks run in Admin mode & Tamper Protection Disabled / Defender Disabled, Graphics driver: 2019-1006577-WHQL.
4Intel® Wi-Fi 6 (Gig+) products support optional 160 MHz channels, enabling the fastest possible theoretical maximum speeds (2402 Mbps) for typical 2×2 802.11 AX PC Wi-Fi products.   Premium Intel® Wi-Fi 6 (Gig+) products enable 2-4X faster maximum theoretical speeds compared standard 2×2 (1201 Mbps) or 1×1 (600 Mbps) 802.11 AX PC Wi-Fi products, which only support the mandatory requirement of 80 MHz channels.
5As compared to other PC I/O connection technologies including eSATA, USB, and IEEE 1394 Firewire*. Performance will vary depending on the specific hardware and software used. Must use a Thunderbolt™-enabled device.
6802.11ax 2×2 160MHz enables 2402Mbps maximum theoretical data rates, ~3X (2.8X) faster than standard 802.11ac 2×2 80MHz (867Mbps) as documented in IEEE 802.11 wireless standard specifications, and require the use of similarly configured 802.11ax wireless network routers.
7As measured by the time it takes to export a project containing 4K 360 video using PowerDirector 365. The exported video is a 4K, HEVC, 30p, .MP4 @ 37Mbps using the CPU only. Comparisons baselined off of a fixed 15W cooling vs. 18W with DTT and 25W with DTT measurements based on an Intel Preproduction Processor Intel® Core™ i7 -10710U. Performance will vary based on OEM chassis design choices, chassis temperature thresholds, cooling solutions, form factors, and ambient air temperatures. Intel Preproduction Processor: Intel® Core™ i7 -10710U (CML-U 6+2) PL1=18W/25W, 6C12T, Turbo up to 4.7GHz, Memory: 2x16GB DDR4-2667 2Rx8, Storage: Intel® 760p M.2 PCIe NVMe SSD with AHCI Microsoft driver, Display Resolution: 3840×2160 eDP Panel 12.5”, OS: Windows* 10 19H1-18362.ent.rx64-Appx59., Graphics driver: PROD-HC-RELEASES-GFX-DRIVER-CI-MASTER-2334-REVENUE-PR-1006952-WHQL.

Saturday, October 6, 2018

Intel invites for a October 8th event. Intel Core 9th Gen processors presentation?


We don`t know if Intel is going to unveil the 9th cpu Gen that was before rumored as Intel to launch 9th Gen Core CPUs with 8 and 6 cores in October 1st. , at the event in October 8th, Monday, instead.

But the  company is inviting to LEARN ABOUT INTEL`S LATEST PC DEVELOPMENT   and to Tune in at 10 a.m. EDT (7 a.m. PDT) on Monday, Oct. 8, on the Intel Newsroom to learn more about the latest PC performance developments from Intel.

However according to what Intel says: Every PC user is unique, with a wide variety of performance needs and requirements to ensure their success. It is clearly they are talking about new processor, that we enlist again:


Intel News was teasing on twitter about it:


Source: IntelNewsroom

Before related post:
Intel to launch 9th Gen Core CPUs with 8 and 6 cores in October 1st.

Friday, September 7, 2018

Microsoft sends out invitations for Oct 2 event in NYC. New Surface hardware with Intel Core 9th Gen coming.




Microsoft is going to hold a press conference in October 2nd in NYC at 4PM ET (1PM PT) where is expected to unveil new Surface Pro line models and Surface Laptops with the new Intel Core 9th Generation chips since is has been reported Intel will launch the new chips in October 1st

The Intel Core 9th Gen will have quad and octa core options.

News about Windows 10, Office 2019 and other Microsoft products and services might be announced as well.




Sunday, August 12, 2018

Intel to launch 9th Gen Core CPUs with 8 and 6 cores in October 1st.

Mock up.


Based on Intel’s 14 nm manufacturing process, the collection includes 8 core and 6 core CPUs, including Core i9-9900K, the first mainstream desktop Core i9 chip.

The Core i9-9900K would feature  3.6 Ghz processor that could be boosted to 4.7 Ghz with all cores or 5 Ghz with only 1-2 cores, and would support up to 16 code threads.

The Core i7-9700K, on the other hand, would be the first mainstream 8 core processor. It would clock in at 3.6 Ghz and could be boosted up to 4.6 Ghz with all cores running or 4.9 Ghz.

Less exciting would be a range of mid-tier Core i5-9600K processor with six cores, six threads, a 3.7GHz base clock and a 4.3GHz boost with all cores (4.6GHz with one).

Rumors said Intel is going to refresh the line in late 2019 based on 10nm mfg process.

Monday, March 26, 2018

Korean mobile carrier KT to commercialize 5G network services in March 2019. Samsung and Intel parts suppliers.




The 5G platform will be based on end-to-end (E2E) Orchestrator, a network virtualization control system, which will manage KT’s 5G network from core equipment to base stations to devices in real time.

The platform will be essential to providing 5G-based autonomous driving, immersive media and internet of things services, the company said. 

“E2E Orchestrator can be flexibly converted for different uses according to changing demand for services, which boasts high efficiency and provides a great variety of 5G services for consumers,” the company said. 

KT is planning to implement connected car, smart factory and drone services by using the platform. 

At a press conference in Gwanghwamun, central Seoul, on Thursday, KT demonstrated a multi-play virtual reality game based on the 5G network, dubbed “Special Force VR,” co-developed by game firm Dragonfly. 

Players in Gwanghwamun were connected with other players in Sinchon, northwestern Seoul, via KT’s 5G network to play the game in real time. 

“KT will perfectly deliver the promise made to the world at the PyeongChang Olympics,” said KT’s network business head Oh Seong-mok. “KT will start providing perfect 5G services in March 2019 based on our technologies and know-how that have been built up.” 

For the past three years, KT applied for more than 100 patents for preparations of pilot 5G services for the Olympics. And it has secured core technologies for the 5G network, it said.

Major parts of the KT-led PyeongChang 5G specifications in cooperation with Samsung Electronics, Intel and other global equipment vendors were adopted by 3GPPas non-standalone standards in December. 

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