Showing posts with label qualcomm. Show all posts
Showing posts with label qualcomm. Show all posts

Wednesday, November 25, 2020

Qualcomm to hold the 5th annual Tech Summit Digital 2020 on Dec 1-2, 2020. Snapdragon 875 some specifications.

 



Qualcomm will hold the 5th annual Tech Summit Digital 2020 (virtual) event on 
December 1 & 2, 2020 7am PST / 10am EST / 2pm GMT
and invites you to join their live stream to hear Qualcomm® executives and leaders from across the mobile industry share their views on the global expansion of 5G along with the latest and greatest Snapdragon experiences that will set the bar for 2021. 

Snapdragon 875 is set to power the next range of flagships starting in early 2021. The chipmaker will unveil the chip at the Qualcomm Summit on this event, with availability expected from early 2021

Some specifications have surged:


Leaked Snapdragon 875 specifications:

  • Kryo 685 CPU, will be built on Arm v8 Cortex tech
  • 3G/ 4G/ 5G modem
  • Will use millimeter wave (mmWave) and sub-6 GHz bands
  • Low-power audio subsystem combined
  • Aqstic Audio Technologies
  • WCD9380 and WCD9385 audio codec
  • Adreno 660 GPU
  • Adreno 665 VPU
  • Adreno 1095 DPU
  • Compute Hexagon DSP
  • Hexagon Vector eXtensions
  • Hexagon Tensor Accelerator
  • Qualcomm Secure Processing Unit (SPU250)
  • Spectra 580 image-processing engine
  • Snapdragon Sensors Core Technology
  • External 802.11ax, 2×2 MIMO, and Bluetooth Milan
  • Quad-channel package-on-package
  • LPDDR5 SDRAM


As always, Qualcomm Snapdragon™ is synonymous with premium-tier mobile performance and experiences – this year will be no different. Cristiano Amon, president of Qualcomm Incorporated, will host the event, along with Alex Katouzian, senior vice president and general manager of mobile for Qualcomm Technologies.

You can watch the event on:



Note:
Watch the livestreams daily at qualcomm.com/snapdragonsummit and follow Qualcomm on Twitter for live updates before and during the keynotes. Our live stream will also be shown in China on the iQiYi platform, more info can be found at qualcomm.cn. Please tune in and don’t forget to tag your posts #SnapdragonSummit.

More information on Qualcomm

Sunday, October 20, 2019

LG Innotek World’s first 5G Communication module for Automotive runs on Qualcomm chip


LG Innotek today announced it has developed a communication module for automotive based on 5G (5th Generation) Qualcomm chip. The company is the first company to develop a 5G communication module for automotive using Qualcomm chips that can be applied to vehicles.
5G communication module for automotive is a component that uses the 5G mobile telecommunication technology to enable transmission of data between a vehicle and a cellular base station and wireless network connection. This module combines a communication chip, memory, and RF (radio frequency) circuit and is generally mounted on the inside a vehicle or in a vehicle communication device on the roof.
This module makes possible sharing of real-time traffic information, precise location measurement, V2X (Vehicle-to-Everything: communication between a vehicle and objects), and transmission of larger amounts of data. In other words, this module secures the key functions that are needed for entirely autonomous driving that requires no involvement of the driver.
Recently, other companies also have focused on development of 5G communication module, which is a key component of an autonomous vehicle. In particular, companies have been in a fierce competition to successfully develop a module that runs on the Qualcomm® SnapdragonTM Automotive 5G Platform.
However, using the 5G technology for communication modules for automotive was not easy because it uses high frequency bands, causing higher loss of signals than LTE (Long Term Evolution, 4G mobile telecommunication technology) as well as high heat generation due to transmission of larger amounts of data.
To solve this problem, LG Innotek used its proprietary RF circuit design technology, high precision and density modularized technology as well as heat resistant new materials.
The company’s 5G communication module has a low latency (1ms or less), which is one-tenth of that of an LTE module. This is why 5G technologies come into the spotlight in autonomous vehicle areas. Because it requires more immediate response to the changes in real-time situations.
For example, if an autonomous vehicle driving at 100 kilometers (62 miles) per hour detects an obstacle and activates the urgent braking function, braking starts after the vehicle moves 1.4m (4.5ft) with an LTE module, but with a 5G module, braking starts after the vehicle moves 2.8cm (0.09ft) because the latency is lower.
Also, this module has higher heat-resistance. It can withstand and is not easily deformed by the high heat generated by 5G network as well as direct sunlight on the vehicle roof. The module uses new plastic materials that are less sensitive to temperature change and is manufactured by applying new engineering methods in the processes of hardening and coating.
LG Innotek’s 5G communication module for vehicles is small and slim, having an overall size of half a credit card. Its 40mm (width) X 50mm (length) X 3.5mm (thickness) size makes it easy to be installed anywhere on the inside or outside of a vehicle. It packs about 480 components including communication chip, memory, RF circuit, and C(Cellular)-V2X into the module.
Also, installing the module is highly convenient. Because it is compatible with LTE modules, the user only has to replace the LTE module with the 5G module in the same spot without changing the system design.
The 5G module also comes with software optimized for the module. Another advantage of the product is that it can be used regardless of the region or vehicle type because it follows the 3GPP Release 15, the newest 5G standard, of 3rd Generation Partnership Project (3GPP).
LG Innotek official said, ”The successful development of 5G communication module for vehicles will speed up the commercialization of entirely autonomous vehicles and connected cars by manufacturers. Our company will continue to introduce innovative products that can provide drivers with a safe, convenient, and enjoyable driving experience.”

LG Innotek’s 5G Communication Module for Automotive

LG Innotek’s 5G Communication Module for Automotive

Wednesday, August 22, 2018

It`s Official: Qualcomm confirms 7nm process node for new chip (SD855?) paired with X50 5G modem.



Qualcomm announced today is working with smartphones makers around the world to launch its upcoming flagship mobile platform, a system on chip (SOC) built on the 7nm process node that can be paired with the company X50 5G modem, which could be the the first in its class for smartphones and mobiles devices. 

Qualcomm is planning to give more details of its next gen flagship mobile platform in the 4th quarter of 2018.

Qualcomm is not giving an official name just yet for the new chip in order to differentiate chips for smartphones from laptop chips. So SD 855 is not an official name for it.


Press Release:

Qualcomm Samples Next Generation Mobile Platform to Customers.

Plans to Bring 5G Connectivity and a 7nm SoC to Power the Next Era of Mobile Devices

Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated , announced that its upcoming flagship mobile platform will feature a system-on-chip (SoC) built on the 7nm process node. The 7nm SoC can be paired with the Qualcomm® Snapdragon™ X50 5G modem, which is expected to be the first 5G-capable mobile platform for premium tier smartphones and other mobile devices. Qualcomm Technologies has begun sampling of its upcoming flagship mobile platform to multiple OEMs developing next-generation consumer devices. The upcoming platform will transform industries, encourage new business models and improve the consumer experience as operators come online with 5G services later in 2018 and through 2019.

“We are very pleased to be working with OEMs, operators, infrastructure vendors, and standards bodies across the world, and are on track to help launch the first 5G mobile hotspots by the end of 2018, and smartphones using our next-generation mobile platform in the first half of 2019,” said Cristiano Amon, president, Qualcomm Incorporated. “Qualcomm Technologies’ continued leadership in research and engineering allows for a future of increased innovation across multiple sectors as 5G connectivity becomes ubiquitous.”

This flagship mobile platform with 5G is designed to enable premium connected devices that bring new intuitive experiences and interactions with power-efficient on-device AI, superior battery life, and performance while extending globally to innovative technologies, solutions, experiences and applications in automotive and IoT.

Full details regarding the next-generation flagship mobile platform from Qualcomm Technologies is planned to be announced in the fourth quarter of 2018.

Monday, July 23, 2018

Qualcomm unveiled the world’s first fully-integrated 5G NR (mmWave) and sub-6 GHz RF modules for smartphones.





Qualcomm Delivers Breakthrough 5G NR mmWave and Sub-6 GHz RF Modules for Mobile Devices.

New family of mmWave antenna modules makes mobile mmWave viable in a smartphone form factor, supporting large-scale commercialization.

Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, today unveiled the world’s first fully-integrated 5G NR millimeter wave (mmWave) and sub-6 GHz RF modules for smartphones and other mobile devices. The Qualcomm® QTM052 mmWave antenna module family and the Qualcomm® QPM56xx sub-6 GHz RF module family pair with the Qualcomm® Snapdragon™ X50 5G modem to deliver modem-to-antenna capabilities across several spectrum bands, in a very compact footprint that is suited for integration in mobile devices.

“Today’s announcement of the first commercial 5G NR mmWave antenna modules and sub-6 GHz RF modules for smartphones and other mobile devices represents a major milestone for the mobile industry. Qualcomm Technologies’ early investment in 5G has allowed us to deliver to the industry a working mobile mmWave solution that was previously thought unattainable, as well as a fully-integrated sub-6 GHz RF solution. 

Now, these type of modem-to-antenna solutions, spanning both mmWave and sub-6 spectrum bands, make mobile 5G networks and devices, especially smartphones, ready for large scale commercialization,” said Cristiano Amon, President, Qualcomm Incorporated. “With 5G, consumers can expect gigabit-class Internet speeds with unprecedented responsiveness in the palm of their hands, which stand to revolutionize the mobile experience.”

To date, mmWave signals have not been used for mobile wireless communications due to the many technical and design challenges they pose, which impact nearly every aspect of device engineering, including materials, form-factor, industrial design, thermals, and regulatory requirements for radiated power. As such, many in the mobile industry considered mmWave highly impractical for mobile devices and networks, and thus unlikely to materialize.

The QTM052 mmWave antenna modules work in tandem with the Snapdragon X50 5G modem, as a comprehensive system, to help overcome the formidable challenges associated with mmWave. They support advanced beam forming, beam steering, and beam tracking technologies, drastically improving the range and reliability of mmWave signals. They feature an integrated 5G NR radio transceiver, power management IC, RF front-end components and phased antenna array. 

They support up to 800 MHz of bandwidth in the 26.5-29.5 GHz (n257), as well as the entire 27.5-28.35 GHz (n261) and 37-40 GHz (n260) mmWave bands. Most importantly, the QTM052 modules integrate all these capabilities in a very compact footprint, such that up to four of them can be integrated in a smartphone. This allows OEMs to continue evolving the industrial design of their mobile devices, offering attractive form factors combined with the benefits of extremely high speeds from mmWave 5G NR, and making such devices available for launch as early as the first half of 2019.

While mmWave is best suited for providing 5G coverage in dense urban areas and crowded indoor environments, broad 5G NR coverage will be achieved in sub-6 GHz spectrum bands. As such, the QPM56xx RF module family (including the QPM5650, QPM5651, QDM5650, and QDM5652) is designed to allow smartphones based on the Snapdragon X50 5G modem to support 5G NR in sub-6 GHz RF bands. The QPM5650 and QPM5651 feature integrated 5G NR PA/LNA/Switch and filtering subsystem. 

The QDM5650 and QDM5652 feature integrated 5G NR LNA/switch and filtering subsystem for diversity and MIMO support. All four modules offer integrated SRS switching required for optimum massive MIMO applications and support for 3.3-4.2 GHz (n77), 3.3-3.8 GHz (n78) and 4.4-5.0 GHz (n79) sub-6 bands. These sub-6 GHz RF modules provide mobile device makers with a viable path to delivering on the promise of 5G NR massive MIMO technology in mobile devices.

Both the QTM052 mmWave antenna module family and the QPM56xx sub-6 GHz RF module family are now sampling to customers.



Qualcomm lanza nueva antena 5G para telèfonos inteligentes y mòviles.



Qualcomm llevó a cabo lo que se dice que son los primeros módulos de antena 5G NR mmWave y sub-6GHz completamente integrados, lo que ayuda a habilitar la ola de teléfonos inteligentes 5G y dispositivos móviles que se esperan para 2019.

En un comunicado, el presidente de Qualcomm, Cristiano Amon, calificó el lanzamiento como "un hito importante para la industria móvil".

Sherif Hanna, directora de marketing de productos 5G de Qualcomm, dijo a Mobile World Live que el lanzamiento complementa la presentación de la compañía de su módem X50 5G en octubre de 2016. Donde el X50 sirve como el cerebro de un dispositivo, Hanna explicó que los nuevos módulos de antena actuarán como los ojos de un dispositivo y orejas

Los módulos QTM052 mmWave incluyen antenas de cuatro milímetros de haz con formación de haz, dirección del haz y tecnología de seguimiento del rayo; un transceptor de radio; amplificadores de potencia para aumentar la potencia de la señal; y filtros para perfeccionar la banda derecha.

Qualcomm ofrece diferentes variantes de módulos que admiten hasta 800MHz de espectro en la banda 26.5-29.5GHz, así como bandas de 27.5-28.35GHz y 37-40GHz.

La firma de análisis ABI Research dijo que lo más llamativo del anuncio fue "la velocidad con la que Qualcomm ha logrado entender las complejidades y los desafíos asociados con la implementación de mmWave en un formato muy compacto".

La compañía también dio a conocer nuevas variantes de módulos 5G sub-6GHz con soporte para las bandas 3.3-4.2GHz, 3.3-3.8GHz y 4.4-5.0GHz.

Diseño de próxima generación
En febrero, 19 OEM de dispositivos se conectaron para usar el módem X50 en sus productos 5G a partir de 2019. Hanna dijo que no todas las compañías en esa lista inicialmente fabricarán dispositivos compatibles con mmWave (con algunos, dependiendo de la región objetivo, optando en cambio por hacer que los dispositivos 5G sub-6GHz comiencen), pero señaló que "una parte saludable" de ellos está planeando incorporar la tecnología.

Pero dado que la mayoría de los fabricantes de equipos originales nunca antes habían utilizado mmWave, señaló que Qualcomm ha estado trabajando con ellos más de cerca que nunca para diseñar dispositivos de próxima generación. "Literalmente afecta todos los aspectos del teléfono, desde el grosor hasta los bordes, a los materiales que usa, a la ubicación. Entonces no se puede diseñar en el vacío ", dijo.

El ejecutivo también señaló que se espera que el módulo mmWave sea utilizado tanto en dispositivos inalámbricos fijos como móviles.

Tanto los módulos mmWave como sub-6GHz están actualmente muestreando a los clientes.

Wednesday, May 30, 2018

CES 2019: Samsung Galaxy S10 coming with ultrasonic sensor for in-display fingerprint recognition made by Qualcomm.



Chinese smartphones manufacturers are making the in display fingerprint sensor with a optical way technology and it is not more accurate than the ultrasonic in display fingerprint  sensor technology that Qualcomm is offering to Samsung.

How this ultrasonic sensor technology works?

It works by transmitting an ultrasonic pulse against the finger to map the pores and ridges that are unique to each fingerprint. This lets the sensor collect additional depth data for accurate 3D reproduction of the fingerprint to ensure higher accuracy.

The display panel will be supplied by Samsung Display  and Qualcomm is said to be supplying the ultrasonic fingerprint sensor.

This is the first time we are hearing about Qualcomm making it. On before news Samsung was supposed  making it and that will use it not only on smartphones but on smart home devices, home appliances and automobiles, as well.

However recent news confirmed Samsung is adopting the Qualcomm`s technology.

"Samsung Electronics has decided to commercialize the display fingerprint reader on the Galaxy S10," Samsung Electronics said in a statement. "We know Samsung Display is in charge of the display and Qualcomm is in the spotlight." Display Fingerprint recognition is the key to making fingerprints visible on the display without exposing the sensor to the outside. Samsung OLED reportedly an implementation of the display fingerprint in such a manner as to position the ultrasonic sensor on the back (OLED) panel. Qualcomm will be responsible for the supply of ultrasonic sensors and Samsung Display will be responsible for manufacturing the S10 panel and attaching the sensor to the panel. The ultrasound method is a technology for discriminating fingerprint shapes and features by changing the intensity and position of ultrasonic waves. Due to the nature of the ultrasonic transmission through objects, the sensor can be operated from the back of the panel. Samsung Electronics uses ultrasonic technology because the sensor is not exposed to the outside and has less influence on the panel structure and image quality. 

Besides that , Samsung is working in more exciting new features for the 10th anniversary smartphone Galaxy S10 which will be unveiled at CES 2019 just before the MWC 2019 where the company is going to unveil its foldable smartphone.


etnews via sammobile

Thursday, February 22, 2018

Qualcomm picks Samsung for its next SnapDragon 855 chip.


Qualcomm is getting set to build it’s Snapdragon 855 chip on a 7nm process and picked Samsung for to make it.

The South Korean manufacturing giant announced that Qualcomm’s future 5G mobile device chips will be based on its 7nm LPP manufacturing process and the technology node will introduce EUV (EUV lithography). Samsung debuted the 7nm LPP EUV process in May 2017 and one month later, it announced that it will mass-produce 7nm earlier in 2018

Samsung revealed that, compared with the current 10nm FinFET process, 7nm will achieve a 40% reduction in area, 10% performance increase, and 35% power consumption decline. Interestingly, Qualcomm also introduced its X24 baseband based on the 7nm process this month.




Wednesday, February 14, 2018

Qualcomm announced Snapdragon X24: World’s first 2 Gbps LTE modem. Video.




Gives glimpse of 5G experience, doubles speed over first generation Gigabit LTE modem, industry’s first-announced 7nm chip.

The excitement continues to build as we approach 5G launch in 2019. Qualcomm Technologies aims to put 5G smartphones in your hands by the first half of next year. In anticipation, operators are strengthening the Gigabit LTE foundation on which their future 5G networks will be built.

Gigabit LTE will provide high-speed coverage in areas where 5G signals aren't available and a consistency of experience for users of 5G devices that have Gigabit multimode capability, like those utilizing the Qualcomm Snapdragon X50 5G modem family. Additionally, Gigabit LTE improves network capacity and provides an enhanced mobile experience.

Gigabit LTE continues to gain momentum as more operators and mobile device OEMs jump on board. Today, 45 operators in 26 countries have embraced the technology and 17 commercially available devices are powered by Snapdragon Gigabit LTE modems, making Gigabit LTE a smashing success.

We broke several barriers since Qualcomm Technologies announced its first Gigabit LTE modem in 2016, yet we continue to push the modem performance envelope. Today, Qualcomm Technologies announced its third generation Gigabit LTE solution: The Qualcomm Snapdragon X24 LTE modem. It represents several significant mobile industry firsts:

The first announced modem to support Category 20 LTE download speeds of up to a blistering 2 Gbps

The first announced 7nm chip, the most advanced commercially available silicon manufacturing process

The first announced LTE modem to support downloads on up to 20 independent spatial streams, including 4x4 MIMO on up to 5 aggregated carriers

The first announced LTE modem to support up to 7x carrier aggregation

What does this unprecedented feature set mean to you? It means that you are closer than ever to experiencing 5G-like speeds today.

The improved network capacity and real-world download speed that Snapdragon X24 offers will enable a new generation of applications and services, such as enjoying delay-free 6 degrees of freedom (6DoF) VR videos, immersive gaming, and downloading movies in 4K resolution and higher in just a few seconds – for both single users as well as many users sharing the same cell site.

All of this is delivered by a tiny chip that’s engineered to provide fantastic power efficiency for your device, thanks to the cutting-edge 7nm process on which it is built.

But blazing-fast, real-world download speeds alone do not explain the true significance of the Snapdragon X24 LTE modem. Featuring more combinations of LTE carriers, 4x4 MIMO configurations, and a higher number of total LTE spatial streams compared to previous generations, the Snapdragon X24 LTE modem will help expand the global Gigabit LTE coverage footprint by accommodating a much wider range of configurations in both licensed and unlicensed spectrum. The true power of the Snapdragon X24 LTE lies in its ability to help mobile operators fully mobilize their spectrum assets and maximize the capacity of their Gigabit LTE networks, while extending the capabilities of Gigabit LTE as the foundation for multi-mode 5G devices and networks.

For example, let’s consider three operators with different spectrum holdings in our previous generations. The Snapdragon X24 LTE modem can help operator 1 utilize more of its spectrum assets and aggregate additional LTE carriers to achieve gigabit speeds. It can help operator 2 enjoy higher capacity and better spectral efficiency by adding more MIMO layers on their existing spectrum and achieve gigabit speeds on fewer aggregated carriers. Finally, Snapdragon X24 can allow operator 3, who may have very little licensed spectrum to use freely available unlicensed spectrum, with License Assisted Access (LAA) technology to offer its customers gigabit speeds.

Check out these three different scenarios that show the gain of X24 vs X16 and X20.



Scenario 1: High-order aggregation over carriers

Scenario 2: High-order aggregation over MIMO spatial streams

Scenario 3: Boosting the speed through unlicensed spectrum

The Snapdragon X24 LTE modem is packed with an array of other important features. It supports Category 20 LTE upload speeds of up to 316 Mbps, boosted by 3x20 MHz carrier aggregation and up to 256-QAM. Snapdragon X24 also offers additional capacity to mobile operators through support of Full Dimension Multi-Input Multi-Output (FD-MIMO), a Massive MIMO technology that is foundational to future 5G NR networks.

Additionally, Snapdragon X24 supports the concurrent multi-constellation, multi-frequency global navigation satellite system (GNSS), which is optimized to provide highly accurate location positioning required in applications such as autonomous driving and V2X.

When can you get your hands on Snapdragon X24? We’ve already begun sampling it to our customers and we expect the first mobile devices powered by the Snapdragon X24 LTE modem to be available by end of 2018.

We’re very excited to show a live demonstration of the Snapdragon X24 LTE modem’s eye-popping 2 Gbps download speeds at Mobile World Congress Barcelona in conjunction with Ericsson, Telstra, and NETGEAR. If you’re attending, be sure to visit our booth (Hall 3, Stand #3E10) to witness our latest breakthrough. We also demonstrated the blazing speed of 2Gbps with our partner Nokia. Check it out here  - you don’t want to miss it.


Monday, September 18, 2017

Apple`s iPhone X sensing technology to ramp up demand of Qualcomm and Himax Technologies suppliers.





A number of new features that come along with Apple's newly released iPhone X such as 3D sensing are likely to become new standards for next-generation smartphones launched by Android-based smartphone vendors, industry analysts say.

The maturing 3D sensing technology and related applications that enables facial recognition, creates 3D emojis and performs augmented reality (AR) experiences will prompt Android phone makers to follow suit.

Major players in the Android camp, including Samsung Electronics and Huawei, certainly will jump onto the bandwagon, noted the sources, adding that demand for 3D sensor modules is likely to experience an explosive growth in 2018-2019.

3D sensor chips suppliers including Qualcomm and Himax Technologies will benefit significantly from the emerging trend.

While wireless charging is not a new technology or feature for smartphones, the support of Wireless Power Consortium's Qi standards by iPhone X and iPhone 8 devices will promote further adoption and development of wireless charging technology.

In addition to AirPower, an Apple-designed wireless charging accessory coming in 2018, third-party wireless charging devices will be also allowed to charge up iPhone devices, which in turn will encourage IC-design houses to develop diverse chips for wireless charging.

Taiwan-based chipset suppliers such as MediaTek and Richtek Technology will be able to ramp up their shipments of wireless charging chips along with the ongoing development.

Global shipments of wireless charging pads totaled 60-80 million in 2016 and are expected to grow by annual rate of 30% in the next few years, are estimated.

Thursday, July 6, 2017

Qualcomm is filling a complaint with the ITC (US) demanding to ban iPhone imports.



Qualcomm Files Patent Infringement Complaints Against Apple with International Trade Commission and Federal Court.

ITC Complaint Seeks to Ban Import of Infringing Apple Products.

Qualcomm Incorporated  today announced that it is filing a complaint with the United States International Trade Commission (ITC) alleging that Apple has engaged in the unlawful importation and sale of iPhones that infringe one or more claims of six Qualcomm patents covering key technologies that enable important features and functions in iPhones. Qualcomm is requesting that the ITC institute an investigation into Apple’s infringing imports and ultimately issue a Limited Exclusion Order (LEO) to bar importation of those iPhones and other products into the United States to stop Apple’s unlawful and unfair use of Qualcomm’s technology. 

The Company is seeking the LEO against iPhones that use cellular baseband processors other than those supplied by Qualcomm’s affiliates. Additionally, Qualcomm is seeking a Cease and Desist Order barring further sales of infringing Apple products that have already been imported and to halt the marketing, advertising, demonstration, warehousing of inventory for distribution and use of those imported products in the United States.

“Qualcomm’s inventions are at the heart of every iPhone and extend well beyond modem technologies or cellular standards,” said Don Rosenberg, executive vice president and general counsel of Qualcomm. “The patents we are asserting represent six important technologies, out of a portfolio of thousands, and each is vital to iPhone functions. 

 Apple continues to use Qualcomm’s technology while refusing to pay for it. These lawsuits seek to stop Apple’s infringement of six of our patented technologies.”

The six patents, U.S. Patent No. 8,633,936, U.S. Patent No. 8,698,558, U.S. Patent No. 8,487,658, U.S. Patent No. 8,838,949, U.S. Patent No. 9,535,490, and U.S. Patent No. 9,608,675 enable high performance in a smartphone while extending battery life. Each of the patents does so in a different way for different popular smartphone features; https://www.qualcomm.com/iphone-infographic 

While the technologies covered by the patents are central to the performance of the iPhone, the six asserted patents are not essential to practice any standards in a mobile device or subject to a commitment to offer to license such patents.

Qualcomm today also filed a complaint against Apple in the U.S. District Court for the Southern District of California alleging that Apple infringes the same six patents in the complaint filed in the ITC. The complaint seeks damages and injunctive relief.

Qualcomm expects that the ITC investigation will commence in August and that the case will be tried next year.



Wednesday, June 28, 2017

Qualcomm Announces Advanced Fingerprint Scanning and Authentication Technology.


Resultado de imagen para qualcomm



Capable of Scanning Through Display, Thick Glass and Metal with Underwater Operation, Heartbeat and Blood Flow Detection

At Mobile World Congress Shanghai 2017, Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated today announced Qualcomm® Fingerprint Sensors, next-generation ultrasonic fingerprint solutions which bring new and enhanced features to the previous generation Qualcomm® Snapdragon Sense™ ID fingerprint technology. 

The suite of features consists of sensors for Display, Glass and Metal, detection of directional gestures, and underwater fingerprint match and device wake-up. It is also the first commercially announced integrated ultrasonic-based mobile solution to detect heart beat and blood flow for improved mobile authentication experiences.

“We are excited to announce Qualcomm Fingerprint Sensors because they can be designed to support sleeker, cutting-edge form factors, unique mobile authentication experiences, and enhanced security authentication,” said Seshu Madhavapeddy, vice president, product management, Qualcomm Technologies, Inc. “This provides OEMs and operators with the ability to offer truly distinct, differentiated devices with added value on truly groundbreaking new devices.”

Qualcomm Fingerprint Sensor for Display is the mobile industry’s first commercially announced multi-functional ultrasonic solution capable of scanning through OLED display stacks of up to 1200um, along with enrolling and matching, and Qualcomm Fingerprint Sensors for Glass and Metal are the first commercially announced to scan through up to 800 µm of cover glass and up to 650 µm of aluminum, an improvement over the previous generation’s 400 µm capability for glass or metal.

Qualcomm Fingerprint Sensors are designed as both an integrated solution with Qualcomm® Snapdragon™ Mobile Platforms, and as standalone sensors that can be used with other non-Snapdragon Platforms. Qualcomm Fingerprint Sensors for Glass and Metal are designed to be compatible with the recently announced Snapdragon 660 and 630 Mobile Platforms, and Qualcomm Fingerprint Sensors for Display, Glass and Metal are designed to be compatible with future Snapdragon Mobile Platforms and non-Snapdragon platforms.

The new suite of features, compared to the previous generation, supports more design flexibility for operators and original equipment manufacturers (OEM) by making it easier to differentiate products with unique form factors and advanced features and designs. Qualcomm Fingerprint Sensors for Glass and Metal are expected to be available to OEMs this month, and are expected to arrive in commercial devices in the first half of 2018. Qualcomm Fingerprint Sensor for Display is expected to be available for OEMs to evaluate in the fourth quarter of 2017.

With Vivo Communication Technology Co. Ltd., Qualcomm Technologies will be demonstrating Qualcomm Fingerprint Sensors for Display and Metal using modified versions of the VIVO XPlay 6. Qualcomm Technologies will also be demonstrating Qualcomm Fingerprint Sensors for Glass using a modified device designed for demo purposes only. All demonstrations can be found at Qualcomm Technologies’ booth W5.E90 (Hall W5) at MWC Shanghai.

Thursday, February 23, 2017

MWC 2017: Qualcomm and LG Bring 5G and Cellular-V2X Communications Into Vehicles.



Companies use Their Decade-long Experience Delivering Automotive Solutions to Accelerate the Availability of Next-generation Wireless Technology.

Today, Qualcomm Incorporated (NASDAQ: QCOM) through its subsidiary, Qualcomm Technologies, Inc., and LG Electronics (LG) announced coordinated efforts to facilitate testing and adoption of 5G and Cellular-V2X (C-V2X) communications into vehicles. 

Qualcomm Technologies and LG expect to showcase these next-generation wireless technologies through trials during the first half of 2018. This work builds on the long-established relationship between Qualcomm Technologies and LG since the two Companies delivered their first telematics system in 2004.

On the path to 5G, LG is developing advanced automotive connectivity solutions based on Qualcomm Technologies' connected car platform, which features support for Gigabit LTE speeds using the Qualcomm® Snapdragon X16 LTE modem, and is complemented by the QCA65x4 Wi-Fi 802.11ac solution. The connected car platform also supports 802.11p/DSRC and C-V2X, based upon 3rd Generation Partnership Project (3GPP) Release 14 specifications.

"The advanced wireless capabilities of 5G and C-V2X will usher in new use cases necessary to fulfill our vision for increasingly connected and autonomous vehicles," said Kim Jin-yong, executive vice president, VC Smart Business Unit, LG Electronics. "As a leading inventor of 5G technologies and our key modem provider for telematics, Qualcomm Technologies is the company of choice for bringing the next-generation wireless solutions that leading automakers need and expect."

With a strong evolution path to 5G, C-V2X technology is a key feature for safety conscious and autonomous driving solutions. C-V2X complements other Advanced Driver Assistance Systems (ADAS) sensors, such as cameras, radar and LIDAR, to provide information about the vehicle's surroundings, even in non-line-of-sight (NLOS) scenarios. 

In addition to allowing for 360 degree NLOS, C-V2X is also designed to allow for enhanced situational awareness by detecting and exchanging information using direct communications in the 5.9GHz ITS band with other vehicles, infrastructure and pedestrians' devices, as well as network-based communications to cloud services using commercial cellular bands. Compared to current technologies, C-V2X is designed to deliver enhanced V2X direct communication range, reliability, latency and superior NLOS performance. The technology is supported by a broad ecosystem based on 3GPP Release 14 specifications, with trials expected to begin later this year.

"Wireless communications provide the vehicle with data that truly complements what other sensors deliver. For instance, C-V2X and its evolution to 5G can help the car discover what is around corners, detecting a pedestrian's smartphone or a car approaching an intersection even when the object is obstructed by buildings or other large vehicles," said Patrick Little, senior vice president and general manager, automotive, Qualcomm Technologies, Inc. 

"Building on our successful collaboration on telematics and infotainment systems, which have resulted in more than 25 million cumulative units shipped to date for carmakers throughout all key automotive regions, we are pleased to expand our relationship with LG in ushering in both C-V2X and 5G technologies in future vehicles."

C-V2X evolution to 5G offers more wireless communication capabilities for autonomous vehicles, supporting advanced use cases such as high-throughput sensor data/map sharing among vehicles, see-through capabilities streaming camera information from one car to another, and wideband ranging for improved positioning – all while maintaining backward compatibility with 3GPP Rel. 14 C-V2X. With the ability to support multi-Gigabit speeds, mission-critical services with ultra-reliable low latency communication and massive number of nodes, 5G will support a unified connectivity platform to the always connected, autonomous vehicle of the future.

For more information and demonstrations of 5G, C-V2X, Qualcomm Technologies' connected car platform and other automotive-related technologies, visit the Qualcomm booth at Mobile World Congress in Barcelona, February 27March 2, Hall 3, Stand 3E10, or go to qualcomm.com/c-v2x.

About Qualcomm
Qualcomm's technologies powered the smartphone revolution and connected billions of people. We pioneered 3G and 4G – and now we are leading the way to 5G and a new era of intelligent, connected devices. Our products are revolutionizing industries, including automotive, computing, IoT, healthcare and data center, and are allowing millions of devices to connect with each other in ways never before imagined. Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, all of our engineering, research and development functions, and all of our products and services businesses, including, our QCT semiconductor business. For more information, visit Qualcomm's website, OnQ blog, Twitter and Facebook pages.

About LG Electronics, Inc.
LG Electronics, Inc. (KSE: 066570.KS) is a global leader and technology innovator in consumer electronics, mobile communications and home appliances, employing 77,000 people working in 125 locations around the world. With 2016 global sales of USD 47.9 billion (KRW 55.4 trillion), LG comprises four business units ― Home Appliance & Air Solutions, Mobile Communications, Home Entertainment and Vehicle Components ― and is one of the world's leading producers of flat panel TVs, mobile devices, air conditioners, washing machines and refrigerators. LG Electronics is a 2016 ENERGY STAR Partner of the Year. For more news and information on LG Electronics, please visit www.LGnewsroom.com.

Qualcomm and Snapdragon are trademarks of Qualcomm Incorporated, registered in the United States and other countries.

Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc.


Qualcomm Contacts:
Pete Lancia, Corporate Communications
Phone: 1-858-845-5959


John Sinnott, Investor Relations
Phone: 1-858-658-4813



SOURCE Qualcomm Incorporated

Wednesday, February 22, 2017

GE, Nokia and Qualcomm Unveil First Private LTE-based Trial Network for Industrial IoT.




GE, Nokia and Qualcomm Unveil First Private LTE-based Trial Network Customized for Industrial IoT.

Demo Illustrates Benefits of a Private High-performance LTE-based Network Providing End-to-End Solution for Industrial IoT Market.

GE Digital, Nokia and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated , today announced that the companies have successfully demonstrated a private LTE network for the Industrial Internet of Things (IIoT) market; meshing together each party's platforms and technologies. In addition, the companies have announced plans to further research and conduct live field trials throughout 2017 based on this demonstration, designed to advance the digitization of industrial processes.

Industrial companies often have local connectivity needs and operate in remote locations or temporary sites, such as mines, power plants, offshore oil platforms, factories, warehouses or ports—connectivity for these environments can be challenging. A standalone LTE network to serve devices and users within a localized area can help improve performance and reliability for these industrial settings.

Private LTE-based networks utilize LTE-based technologies in shared/unlicensed/dedicated-licensed spectrum. This demonstration utilizes LTE-TDD in the US 3.5 GHz shared spectrum band also known as Citizens Broadband Radio Service (CBRS). With MulteFire™, unlicensed spectrum bands can be used to create private LTE-based networks, such as the 5 GHz band available globally.

As part of the collaboration and technology demonstration, Qualcomm Technologies will provide the wireless technology and device chipsets. Nokia will be providing base station infrastructure plus the Nokia Digital Automation Cloud service to run the network as an on demand private network.  GE is integrating these new types of connectivity into its Predix platform – an open-architecture operating system for the Industrial Internet – to help industrial companies better manage their assets and operations, often found far from the public communications networks.

Further, the agreements between the parties include the installation of a private LTE network at GE Digital's headquarters in San Ramon, Calif., which GE will use to further develop its Predix platform.

"Industries such as factories, warehouses, container ports and airports are increasingly dependent on wireless connectivity to efficiently operate as they continue to utilize more wireless data and connect countless IoT devices to their networks," said Michael Wallace, senior vice president and general manager, Emerging Business, Qualcomm Technologies, Inc. 

"With this collaboration, we are providing companies in the Industrial IoT space the ability to leverage the core advantages of LTE including full mobility, high data rates and coverage, predictable latency, quality of service and ease of deployment."

"Connecting the world's machines to an industrial operating system like Predix is vital to unlocking the data and insights necessary to both increase efficiency and drive adoption of emerging technologies, such as machine learning and computer vision, in industry," said Peter Marx, Vice President, Advanced Concepts, GE Digital. "Bringing LTE-based networks that use shared and unlicensed spectrum to our customers operating in remote and unpopulated locations is a powerful advancement beyond what is available today."

"Private LTE networks bring an entirely new level of advanced, low latency and robust wireless connectivity solutions into verticals and industries," said Stephan Litjens, GM Digital Automation, Nokia.

 "This allows companies to significantly increase the level of automation and analytics in use by adding more sensors, IOT devices, robotics and in general use wireless connectivity for their business and production critical processes. With this collaboration, Nokia accelerates the promise of automated industry by supporting a 'plug n play' private LTE ecosystem. The combination of capabilities from GE, Qualcomm, and Nokia is ideal to bring the promise of analytics in end-to-end industrial IoT solutions to life."

Private LTE-based networks will enable industries and enterprises to own and manage their own LTE network without requiring licensed spectrum and still enjoy the high-performance benefits from LTE with a strong roadmap to 5G. Private LTE-based networks also offer the ability to customize the dedicated LTE network for the company's specific applications, such as optimizing for capacity, quality-of-service, or guaranteed latencies.

The demonstration will be on display at Mobile World Congress in Barcelona from February 27 through March 2 at Qualcomm booth in Hall 3, Booth 3E10.


About Qualcomm 
Qualcomm's technologies powered the smartphone revolution and connected billions of people. We pioneered 3G and 4G – and now we are leading the way to 5G and a new era of intelligent, connected devices. Our products are revolutionizing industries, including automotive, computing, IoT, healthcare and data center, and are allowing millions of devices to connect with each other in ways never before imagined. Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio.  Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, all of our engineering, research and development functions, and all of our products and services businesses, including, our QCT semiconductor business. For more information, visit Qualcomm's website, OnQ blog, Twitter and Facebook pages.



About Nokia 
Nokia is a global leader innovating the technologies at the heart of our connected world. Powered by the research and innovation of Nokia Bell Labs, we serve communications service providers, governments, large enterprises and consumers, with the industry's most complete, end-to-end portfolio of products, services and licensing.


From the enabling infrastructure for 5G and the Internet of Things, to emerging applications in virtual reality and digital health, we are shaping the future of technology to transform the human experience. www.nokia.com


About GE Digital 
GE Digital connects streams of machine data to powerful analytics, providing industrial companies with valuable insights to manage assets and operations more efficiently. World-class talent and software capabilities drive big gains in productivity, availability and longevity. For more information, visit the Web site at www.ge.com/digital.



Qualcomm Contacts: 
Pete Lancia, Corporate Communications 
Phone:  1-858-845-5959 


John Sinnott, Investor Relations 
Phone:  1-858-658-4813 
Email:  ir@qualcomm.com


Nokia Media Enquiries: 
Communications 
Phone: +358 10 448 4900 


SOURCE Qualcomm Incorporated

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