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TI to demonstrate its innovative 3D time-of-flight image sensor chipset with SoftKinetic at CES 2013.
Hardware/software collaboration aims to accelerate adoption of gesture control in TVs and PCs.
Texas Instruments Incorporated (TI) today announced it is collaborating with SoftKinetic®,
a leading provider of end-to-end 3D sensor and gesture recognition
middleware solutions, to grow adoption of gesture control in televisions
(TVs), personal computers (PCs), and a wide variety of other consumer
and industrial devices.
At the 2013 Consumer Electronics Show
(CES), TI will demonstrate its new 3D time-of-flight (ToF) image sensor
chipset, which integrates SoftKinetic's DepthSense® pixel technology
and runs SoftKinetic's iisu® middleware for finger, hand and full-body
tracking. The TI chipset is inside 3D cameras that control a laptop and a
smart TV to access and navigate movies, games and other content with
the wave of a hand. The TV demonstration also features TI's OMAP™ 5
processor, which powers an impressive natural user interface with robust
gesture recognition and full-HD graphics.
Both demonstrations will be showcased at CES 2013 in the TI Village, North Hall of the Las Vegas
Convention Center. "SoftKinetic has long believed that motion control
and gesture recognition is the future of user interfaces and digital
interactivity," said Michel Tombroff, chief executive officer of
SoftKinetic. "We are pleased to collaborate with TI to help bring this
technology into the mass market, and look forward to having our
technology impact the everyday lives of consumers."
Current 3D gesture recognition solutions lack real-time tracking and
suffer from poor sensitivity, which can cause sluggish performance. TI's
ToF chipset, featuring a 3D sensor employing SoftKinetic's
DepthSense pixel technology, overcomes this problem to deliver high
sensitivity and the real-time motion tracking responsiveness consumers
expect. The TI and SoftKinetic solution enables precise tracking of
finger, hand and full-body gestures. TI plans to follow its initial
products with a complete portfolio of solutions suitable for various
applications and form factors. For more information and to see a laptop
demonstration video, visit www.ti.com/3dtof-pr.
"There are a plethora of applications that can benefit from the accuracy and resolution of this technology," said Gaurang Shah,
vice president of Audio and Imaging Products at TI. "Imagine an end
equipment designer tilting, rotating, compressing and expanding a new
product in 3D to inspect and evaluate it on their PC before committing
to a hardware prototype. We believe our collaboration with SoftKinetic
will ignite more applications like this, and foster further technology
innovation to simplify the way we interact with machines."
Not attending CES? Stay connected with TI:
- TI's CES activities
- TI on Twitter
- TI on Facebook
- TI on Google +
About Innovation at TI
For more than 80 years, TI has been
at the forefront of technical innovation, enabling customers to
differentiate products with higher integration, faster speeds and lower
power. Today, we are engineering the future with advances in energy
harvesting, power management, cloud computing, safety and security,
health technology, and more. Learn more about how TI's Analog and
Embedded Processing products are improving how we live, work and play,
today and well into the future, at www.ti.com/innovation.
About Texas Instruments
Texas Instruments semiconductor
innovations help 90,000 customers unlock the possibilities of the world
as it could be – smarter, safer, greener, healthier and more fun. Our
commitment to building a better future is ingrained in everything we do –
from the responsible manufacturing of our semiconductors, to caring for
our employees, to giving back inside our communities. This is just the
beginning of our story. Learn more at http://www.ti.com.
Trademarks
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SOURCE Texas Instruments Incorporated (TI)
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