LTE: Qualcomm® Gobi™ 9x35 3G/LTE Multimode Modem, and RF transceiver chip,Qualcomm WTR3925, for 4G LTE Advanced,announced.
Qualcomm
has announced its fourth-generation 3G/LTE multimode solutions with the
newest modem chipset, the Qualcomm® Gobi™ 9x35, and RF transceiver
chip, the Qualcomm WTR3925, designed for 4G LTE Advanced mobile
broadband connectivity. According to company, together, these solutions
are designed to deliver up to 2X faster LTE Advanced, CAT 6 up to 300
Mbps, along with dual carrier HSUPA and dual band multi-carrier HSPA+.
The
Qualcomm Gobi 9x35 is cellular modem based on the 20 nm technology node
with support for global carrier aggregation deployments up to 40 MHz for
both LTE TDD and FDD Category 6 with download speeds of up to 300 Mbps.
The Gobi 9x35 is backwards compatible and supports all other major
cellular technologies, including DC-HSPA, EVDO Rev. B, CDMA 1x, GSM and
TD-SCDMA. The Qualcomm WTR3925 is RF transceiver chip based on the 28 nm
process, and is Qualcomm Technologies’ first single-chip, carrier
aggregation RF solution that supports all carrier aggregation band
combinations approved by 3GPP. The WTR3925 pairs with the Gobi 9x35
chipset and the Qualcomm RF360™ Front End Solution, which enable the
mobile industry’s premier global, single-SKU LTE platform.
The Gobi
9x35 and WTR3925 are specifically designed to use less power and occupy
less printed circuit board area and continue the trend towards tighter
integration, smaller size and increased performance. The 40 MHz carrier
aggregation capability of the Gobi 9x35, coupled with the comprehensive
carrier aggregation band support of the WTR3925, is engineered to allow
network operators to combine their fragmented spectrum in all possible
3GPP-approved combinations of 5 MHz, 10 MHz, 15 MHz, and 20 MHz
bandwidths to increase capacity and service more subscribers with an
improved end-user experience. The WTR3925 also incorporates the Qualcomm
IZat™ location platform designed for delivery of seamless, global
location.
Press Release:
Qualcomm Technologies Announces Fourth-Generation 3G/LTE Multimode Modem and RF Transceiver Chip
Latest Modem Technology is First Commercial Solution to Offer Global 4G LTE Advanced 40 MHz Carrier Aggregation for FDD and TDD with Download Speeds of up to 300 Mbps
Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc., introduced its fourth-generation 3G/LTE multimode solutions with the newest modem chipset, the Qualcomm® Gobi™ 9x35, and RF transceiver chip, the Qualcomm WTR3925, designed for industry-leading 4G LTE Advanced mobile broadband connectivity. Both products are fourth-generation 3G/LTE multimode solutions from Qualcomm Technologies and offer significant improvements in performance, power consumption and printed circuit board area requirements.
The Qualcomm Gobi 9x35 is the first announced cellular modem based on the 20 nm technology node with support for global carrier aggregation deployments up to 40 MHz for both LTE TDD and FDD Category 6 with download speeds of up to 300 Mbps. The Gobi 9x35 is backwards compatible and supports all other major cellular technologies, including DC-HSPA, EVDO Rev. B, CDMA 1x, GSM and TD-SCDMA. The Qualcomm WTR3925 is the first announced RF transceiver chip based on the 28 nm process, and is Qualcomm Technologies’ first single-chip, carrier aggregation RF solution that supports all carrier aggregation band combinations approved by 3GPP. The WTR3925 pairs with the Gobi 9x35 chipset and the Qualcomm RF360™ Front End Solution, which enable the mobile industry’s premier global, single-SKU LTE platform.
“We’re excited to be expanding our portfolio with a fourth generation of 3G/LTE multimode connectivity solutions,” said Cristiano Amon, executive vice president, Qualcomm Technologies, Inc., and co-president, QCT. “Not only do these products extend our industry-leading Gobi roadmap, they enable the creation of thinner and more efficient mobile devices capable of connecting to the fastest 4G LTE Advanced networks worldwide.”
The Gobi 9x35 and WTR3925 are specifically designed to use less power and occupy less printed circuit board area and continue the trend towards tighter integration, smaller size and increased performance. The 40 MHz carrier aggregation capability of the Gobi 9x35, coupled with the comprehensive carrier aggregation band support of the WTR3925, is engineered to allow network operators to combine their fragmented spectrum in all possible 3GPP-approved combinations of 5 MHz, 10 MHz, 15 MHz, and 20 MHz bandwidths to increase capacity and service more subscribers with an improved end-user experience. The WTR3925 also incorporates the Qualcomm IZat™ location platform designed for delivery of seamless, global location.
For OEMs, the combination of the Gobi 9x35 modem and WTR3925 chipset enables a powerful, single platform that can be used to launch LTE Advanced devices faster at a global scale. Together, these solutions are designed to deliver up to 2X faster LTE Advanced, CAT 6 up to 300 Mbps, along with dual carrier HSUPA and dual band multi-carrier HSPA+.
It is anticipated that Qualcomm Gobi 9x35 and WTR3925 will begin sampling to customers early next year.
About Qualcomm
Qualcomm Incorporated (NASDAQ: QCOM) is the world leader in 3G, 4G and next-generation wireless technologies. Qualcomm Incorporated includes Qualcomm’s licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm’s engineering, research and development functions, and substantially all of its products and services businesses, including its semiconductor business, QCT. For more than 25 years, Qualcomm ideas and inventions have driven the evolution of digital communications, linking people everywhere more closely to information, entertainment and each other. For more information, visit Qualcomm’s website, OnQ blog, Twitter and Facebook pages.
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