SK hynix Inc. (from South Korea) announced to launch the world’s first DDR5 DRAM. It is a high-speed and
high-density product optimized for Big Data, Artificial Intelligence (AI), and
machine learning (ML) as a next-generation standard of DRAM.
Since SK hynix announced the development of World’s
First 16 Gigabit (Gb) DDR5 DRAM on November 2018, the Company has provided its
major partners including Intel with sample products, and has completed various
tests and verification of its functions and compatibility. This will allow SK
hynix to provide its customers with the products once the DDR5 market becomes
active.
In the meantime, SK hynix has conducted a joint-operation of the on-site lab,
system-level test, and simulation with System-on-Chip1) (SoC) manufacturers to verify the functions of DDR5. Also, the Company
validated the compatibility of its DDR5 and the major components on the DRAM module
including register clock driver2)
(RCD), which affect DRAM performance, and power management integrated circuit3) (PMIC). Through these verifications, SK hynix has been collaborating
closely with its global partners.
SK hynix’s DDR5 supports a transfer rate of 4,800 ~
5,600 Megabit-per-second (Mbps), which is 1.8 times faster than the previous
generation – DDR4. It can transmit 9 full-HD (FHD) movies (5GB each) per second
with a 5,600Mbps transfer rate. Its operating voltage is 1.1V being lowered from
1.2V of DDR4, which means that its power consumption is reduced by 20%.
Another notable specification of the Company’s DDR5 is
Error Correcting Code (ECC) inside the chip that can correct even 1-bit-level
errors by itself. With the ECC, the reliability of applications will be
increased by 20 times. The Company’s DDR5 also could build up to 256 Gigabyte
(GB) capacity applying through-silicon-via (TSV) technology.
The Company expects that these eco-friendly
semiconductor memories will reduce both the power consumption and operating
costs of data centers as DDR5 consumes less power and significantly improves
its reliability.
“Intel partnered closely with memory leaders including
SK hynix on the DDR5 spec development starting with early architecture concepts
through JEDEC standardization,” commented Carolyn Duran, Vice President of
Intel’s Data Platforms Group and GM of Memory and IO Technologies. “In
addition, we worked collaboratively with SK hynix on silicon development by
designing and testing prototypes to ensure DDR5 meets its performance goals and
are fully ready for our mutual customers.”
“As SK hynix has launched World’s First DDR5 DRAM, The company could lead the future technology trend in the global DRAM market,” said
Jonghoon Oh, Executive Vice President and Chief Marketing Officer (CMO) at SK
hynix. “SK hynix will focus on the fast-growing premium server market,
solidifying its position as a leading company in server DRAM.”
Meanwhile,
DDR5 standard was published by JEDEC (JEDEC Solid State Technology Association) earlier on July 2020.
According to market intelligence provider Omdia, the DDR5 demand will begin its
surge in 2021, and it will possess 10% of the total global DRAM market in 2022 and
increase to 43% in 2024.
Synopsys, Renesas, Montage Technology, and Rambus have
also stated their commitment to the continuing cooperation in creating the DDR5
ecosystem.
“Synopsys has collaborated with SK hynix to deliver
highly reliable DDR5 solutions for advanced high-performance computing SoCs
requiring ultra-fast and high-capacity memory subsystems,” said John Koeter,
senior vice president of marketing and strategy for IP at Synopsys. “Our
silicon-proven DesignWare DDR5/4 IP has been validated using numerous SK hynix
DDR5 RDIMMs at up to 6400 Mbps, helping designers minimize risk and meet their
high-performance requirements of data-intensive SoCs.”
“As the leading supplier of memory interface products
for every generation of memory over the last twenty years, we pride ourselves
on strong engagements with our key partners and customers. Renesas has worked
closely with SK hynix to qualify a complete portfolio of DDR5 products for
server, client, and embedded markets.” Rami Sethi – Vice President and General
Manager of Renesas’ Data Center Business Division
“Montage Technology is thrilled to partner with SK
hynix on enabling the DDR5 memory ecosystem. As a leading vendor, we have been
collaborating with SK hynix through many DDR generations, and are committed to
providing high-performance, low-power memory interface solutions. Currently,
Montage Technology offers a comprehensive portfolio of DDR5 logic devices – we
are excited to further help SK hynix accelerate DDR5 market adoption,” Geof
Findley, VP of Sales and Business Development at Montage Technology
“Compute-intensive workloads in the data center are
accelerating the need for greater memory capacity and bandwidth,”
said Chien-Hsin Lee, vice president, and general manager, Integrated Circuits at
Rambus. “DDR5 DRAM answers the call with higher data rates and new innovations
that dramatically boost memory performance. Employing a new generation of
memory interface chips, DDR5 RDIMMs and LRDIMMs will unleash the processing
power of server platforms. We are pleased to partner with SK hynix to enable
next-generation technology for the ecosystem and fulfill the growing demand for
DDR5.”
Annotation
■ SoC (System on Chip)
A single-chip solution integrating peripherals that interlock to the system bus
and the central processing unit (CPU).
■ RCD(Register Clock Driver)
An active element that is used in RDIMM and LRDIMM for servers, which ensures the signal quality between the transmitter and the receiver by amplifying commands
and data signals applied to memory from memory controllers.
■ PMIC (Power Management Integrated Circuit)
An integrated circuit that receives the main power input and rectifies, divides
and controls it into a stable and efficient voltage or current required by the
electronics; PMIC is adopted in the DDR5 DRAM module for the first time.
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