Samsung chip Exynos 9810 supports facial recognition.

Samsung is confirming the most interesting improvement and innovation of the Exynos 9810 chip the facial recognition capability. It comes with a neural network-based deep learning capability to identify people in images for swift search.

It’s equipped with a separate security processing unit which gives an added protection to all biometric data. Apart from this, the chip supports fingerprint recognition as well as iris recognition.

The  Exynos 9810 flagship SoC 10-nm LPP process node  comes with four high-performance cores clocked at up to 2.9GHz and four low-power A55 cores. The Exynos 9810 is also packed with a Mali-G72 MP18 GPU. So there are up to 18 cores. Thanks to them the multi-core performance increased by 40%, while the single-core performance was doubled in comparison to the Exynos 8895.

Sure at the MWC 2018 Samsung will show all the Exynos 9810 capabilities on the Galaxy S9/S9+ in February 25.

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Samsung starts mass production of Exynos 9810 processor for the GalaxyS9/S9+ and Note 9.

On the press release below Samsung announced the start of the mass production of its 2nd gen 10nm FinFet process. Although Samsung did not mention the name of the processor, we all know the Koreans mean the Exynos 9810. This processor was silently announced earier this month. The Exynos 9 series SoC will be used in the new flagship devices, including the Galaxy S9 and the Galaxy S9+. Later on, we also expect this chipset to power the Galaxy Note 9.

For its Galaxy S8 series and the Note 8, Samsung made use of the Exynos 8895 chipset. This was Samsung’s first 10nm processor. The newly developed Exynos 9810 is based on the 2nd generation 10-nanometer (nm) FinFET process technology, 10LPP (Low Power Plus).

Press Release:

Samsung Starts Mass Production of its 2nd Generation 10nm FinFET Process Technology

New S3 line is now ready for ramp-up to meet the 10nm demand.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that its Foundry Business has commenced mass production of System-on-Chip (SoC) products built on its second generation 10-nanometer (nm) FinFET process technology, 10LPP (Low Power Plus).

10LPP process technology allows up to 10-percent higher performance or 15-percent lower power consumption compared to its first generation 10nm process technology, 10LPE (Low Power Early). As this process is derived from the already proven 10LPE technology, it offers competitive advantages by greatly reducing turn-around time from development to mass production and by providing significantly higher initial manufacturing yield.

SoCs designed with 10LPP process technology will be used in digital devices scheduled to launch early next year and are expected to become more widely available throughout the year.

“We will be able to better serve our customers through the migration from 10LPE to 10LPP with improved performance and higher initial yield,” said Ryan Lee, vice president of Foundry Marketing at Samsung Electronics. “Samsung with its long-living 10nm process strategy will continue to work on the evolution of 10nm technology down to 8LPP to offer customers distinct competitive advantages for a wide range of applications.”

Samsung also announced that its newest manufacturing line, S3, located in Hwaseong, Korea, is ready to ramp up production of process technologies including 10nm and below. S3 is the third fab of Samsung’s Foundry Business, following S1 in Giheung, Korea and S2 in Austin, USA. Samsung’s 7nm FinFET process technology with EUV (Extreme Ultra Violet) will also be mass produced at S3.

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