CES2013: Texas Instruments to showcase how today's technologies shape tomorrow's real-world applications.

WorldWide Tech & Science. Francisco De Jesùs.

Texas Instruments: Engineering the future of electronics at CES 2013 TI Village to showcase how today's technologies shape tomorrow's real-world applications

 At the upcoming 2013 Consumer Electronics Show (CES), Texas Instruments Incorporated (TI)  will display just a few of the ways its technology is engineering the future of electronics to improve how people live, work and play. On Jan. 8-11, at the Las Vegas Convention Center, the TI Village at CES will feature the latest analog and embedded processing technologies driving intelligent display, entertainment, automotive, energy management, safety, security, health and fitness, and more. Follow all the news and TI's CES highlights at www.ti.com/ces2013-pr.

"Imagine automobiles that significantly increase your safety on the road, while also giving you the entertainment capabilities of your living room and the communications infrastructure of your office. Picture an automated home where entertainment, comfort, security and energy management are handled through a single gateway to the cloud. Envision health technology that allows us to monitor our own internal 'engines,' our heart and blood, 24 hours a day," said Mark Denissen, TI's vice president of strategic marketing. "These are just a few examples of what we'll be showing in the TI Village. We believe it's the perfect venue for designers to see first-hand how TI's analog and embedded processing technologies will help them shape the future of our world."

TI's broad range of analog and embedded processing semiconductor solutions offer the high performance, low power and integration that its customers require to create innovative and differentiated consumer electronics. The TI Village in the North Hall Meeting Rooms at CES 2013 will be packed with a number of themed zones, highlighting specific real-world applications using TI technologies, including:

• Automotive: From front- and rear-seat infotainment, heads-up displays (HUD) and object detection, to eCall and driver assist applications, TI's solutions make driving experiences safer, greener and more enjoyable. See how TI is taking the driver's seat with partners such as QNX Software Systems to pave the way to next-generation automotive infotainment and ADAS features.
• Connected home: Experience the latest in home automation and cutting-edge multimedia applications. Whether surfing personalized movie selections on a smart TV with a natural user interface from YOUi Labs, remotely controlling kitchen appliances or charging your electric vehicle in the garage, TI technology connects your home in ways never before possible.
• Health & fitness: See how TI is helping the world stay fit by enabling new heart rate monitors, body composition meters and pulse oximeters. Perfect your golf swing using our golf club demonstrations and advance athlete protection with helmet technology that alerts of hits that may put the player at risk.
• DLP® Technology: See how the award-winning DLP Pico™ technology enhances screen-challenged devices, such as cell phones, tablets, and cameras/camcorders, and creates content-connected, cord-free mobile products that revolutionize consumer, enterprise, and education experiences. And learn how DLP technology is going beyond traditional projection to drive intelligent display applications for automotive infotainment, safety and more.
• Outdoor: Wherever you may roam, TI's complete portfolio of semiconductor products meet the demands of the world around us, including energy harvesting, wireless power, smart video surveillance and civic wireless connectivity. See demonstrations that take you through a hip urban cafe, alpine ski slopes, a neighborhood backyard and a city street with solar powered lighting.
• Small office: Get a first-hand look at the efficient, secure and "always-on" business office that stays connected, protected and cost-effective with TI's technologies. Come work, or play, with gesture-recognizing and heat-sensing laptops, communication devices connected to the cloud and wireless power devices that not only reduce clutter but also reduce energy consumption.
• Store: Step into the storefront of the future and "shop" a number of advancements in customer demographic and traffic analytics, digital signage and transaction technology. These real-world retail application demonstrations include an exciting array of TI developments in power management, image and graphics processing, and industrial interface.

Not attending CES? Stay connected with TI:

• TI's CES activities
• TI on Twitter
• TI on Facebook
• TI on Google +

About Innovation at TI

For more than 80 years, TI has been at the forefront of technical innovation, enabling customers to differentiate products with higher integration, faster speeds and lower power. Today, we are engineering the future with advances in energy harvesting, power management, cloud computing, safety and security, health technology, and more. Learn more about how TI's Analog and Embedded Processing products are improving how we live, work and play, today and well into the future, at www.ti.com/innovation.

About Texas Instruments

Texas Instruments semiconductor innovations help 90,000 customers unlock the possibilities of the world as it could be – smarter, safer, greener, healthier and more fun. Our commitment to building a better future is ingrained in everything we do – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. This is just the beginning of our story. Learn more at http://www.ti.com.

SOURCE Texas Instruments Incorporated

COMPUTEX 2011: Texas Instruments introduced the power-efficient OMAP4470 applications processor.

World Wide Tech & Science. Francisco De Jesús.

TI's OMAP4470 apps processor: It's all about the user experience Latest OMAP™ 4 platform processor sets new standard for mobile computing, bringing up to QXGA display resolution, HD UIs and 2x Web browsing performance  Building on the OMAP™ 4 platform family's technological achievements , Texas Instruments Incorporated (TI) (NYSE: TXN) introduced at the COMPUTEX 2011 the power-efficient OMAP4470 applications processor, designed to deliver the perfect balance between processing power, graphics, display subsystem functionality and multilayered user interface (UI) composition.  The multicore OMAP4470 processor surpasses current market solutions with clock speeds up to 1.8 GHz, an 80 percent increase in Web browsing performance, increased memory bandwidth, a 2.5x boost in graphics functionality—via the POWERVR™ SGX544 core from Imagination Technologies—and a unique hardware composition engine. Mobile computing and gaming applications running on operating systems such as Android, Linux and the next version of Microsoft Windows will benefit from the OMAP4470 processor's enhanced capabilities.  Customers designing ultrathin laptops, tablets or smartphones around previously released OMAP 4 processors gain the added benefit of pin-to-pin hardware and software compatibility for maximum re-use and faster time-to-market. "Superior mobile computing relies on a user experience that dwarfs all others. Fast and crisp Web browsing, HD and liquid UIs, support for the latest applications—these are the elements consumers judge and buy their devices on. The OMAP4470 processor delivers the maximum experience possible with an unmatched, power-efficient architecture," said Remi El-Ouazzane, vice president, OMAP platform business unit, TI. Making HD UIs a reality Courtesy of its advanced graphics architecture, OMAP4470 enables customers to leverage tomorrow's leading-edge display technology by supporting resolution up to QXGA (2048x1536). The new applications processor drives still more unparalleled HD UIs with simultaneous support for up to three HD screens and up to 2x more layered imaging and video composition than competitive solutions—a capability required by the sophisticated UIs of next generation operating systems.  This feature is enabled by the combination of a hardware composition engine with a dedicated 2D graphics core, a highly sophisticated display subsystem, and dual-channel LPDDR2 memory enabling up to 7.5 GB/s of throughput to composite the graphics and/or video data output. This frees the GPU to perform graphics-intensive tasks such as gaming or widget creation while the compositing process is assigned to more power-efficient hardware subsystems. Powerful enough for desktop applications yet highly power-efficient for mobile applications, Imagination Technologies' POWERVR SGX544 GPU complements the OMAP 4 platform's promise of high performance, low power. The OMAP4470 processor is the first OMAP offering to leverage the POWERVR SGX544. Combining the SGX544's features with the sophisticated OMAP architecture enables TI customers to deliver a new set of applications to end-users, including DirectX-driven games and videos. "Graphics processing is now at the very heart of the mobile computing experience, providing the gateway to an enriched experience of user interface, gaming, location services, web and media," said Hossein Yassaie, CEO, Imagination Technologies. "Combining the OMAP 4 platform's low-power, high-performance architecture with the extensive acceleration capabilities and API support of Imagination's POWERVR SGX544 will enable experiences that will really make people sit up and take notice." OMAP4470 applications processor features and benefits* Feature Benefit Two ARM® Cortex™-A9 MPCores™ running up to 1.8GHz per core 80% increase in Web browsing performance Two ARM Cortex-M3 cores Smart multicore processing optimized for low-power and real-time responsiveness SGX544 graphics core 2.5x overall graphics performance increase; support for DirectX, OpenGL ES 2.0, OpenVG 1.1, and OpenCL 1.1 Hardware composition engine with dedicated 2D graphics core Frees GPU to manage intensive tasks; maximizes power-efficiency Display subsystem Supports as many as three HD displays and up to QXGA (2048x1536) resolution; HDMI supporting stereoscopic 3D Dual-channel, 466 MHz LPDDR2 memory Higher memory bandwidth enables rendering and compositing of multilayer content at high resolutions Complete pin-to-pin hardware and software compatibility Rapid transition and maximum re-use of investment from OMAP4430 and OMAP4460 processors *Comparative data relative to the OMAP4430 processor Availability The 45nm OMAP4470 processor is expected to sample in the second half of 2011, with devices expected to hit the market in first half 2012. These products are intended for high-volume mobile OEMs and ODMs, and are not available through distributors. About Texas Instruments Texas Instruments semiconductor innovations help 80,000 customers unlock the possibilities of the world as it could be – smarter, safer, greener, healthier and more fun. Our commitment to building a better future is ingrained in everything we do – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. This is just the beginning of our story. Learn more at www.ti.com. Trademarks OMAP is a registered trademark of Texas Instruments Incorporated. ARM is a registered trademark, and Cortex is a trademark of ARM Ltd. All other trademarks and registered trademarks belong to their respective owners. TXN-P SOURCE Texas Instruments Incorporated

Taiwan analog IC prices affected by TI - 12-inch fab going on-line

WorldWideTech & Science. Francisco De Jesús.

With Texas Instrument's (TI) 12-inch fab to soon commence production of analog ICs and the company lowering prices since the second half of 2010, a new analog IC price war is expected for the second quarter.

 Though TI's latest moves are aimed at other international players and the new capacity will be mostly for the medium-to-high-end segments, Taiwan-based analog IC companies will likely have to cut prices in the low-end segment.

TI has been positioning since the economic crisis in 2009 to expand market share, according to industry observers. The company has acquired a 12-inch wafer fab in the US and established 8-inch fabs in both Japan and China, forcing other analog IC companies such as Linear, Maxim and Intersil to either give up market share or invest to improve production competitiveness, the observers said.

With some companies tight on cash and the credit market still relatively conservative, TI has cut quotes and increased capacity to gobble up market share.

The top-five analog IC suppliers have historically each controlled about a 10-13% share of the global market. Taiwan-based analog IC companies combined for less than 10% in 2010. TI is attempting to leverage its competitive advantages in funding and capacity to shake up the fragmented market structure.

Though Taiwan-based analog IC companies are not in TI's crosshairs, with fierce price competition in the medium-to-high-end analog and power management IC markets, prices in the low-end segment will be forced down as well. Many Taiwan's IC suppliers have dropped quotes to secure orders from main clients. Their gross margins have retreated from around 43% in 2008 to 33-36% in 2010 and will remain at low levels in 2011.

CES 2011: Acer, Dell, LG, Optoma, and ViewSonic first to show Texas DLP Pico HD chipset

WorldWideTech & Science. Francisco De Jesús.

Texas Instruments Announces DLP Pico™ HD Chipset: Projecting the Future of High Definition Mobile Entertainment and Business Needs Today Acer, Dell, LG, Optoma, and ViewSonic first to show DLP Pico HD products at CES 2011  Today at the International Consumer Electronics Show (CES), Texas Instruments (TI) (NYSE: TXN) unveiled a new era for portable High Definition (HD) entertainment with the new DLP Pico™ HD chipset. Born out of years of research, the latest chip to feature award-winning DLP Pico technology showcases stunning HD (WXGA) video and images on nearly any surface, with more brightness and greater energy efficiency than ever before. The tiny HD chip is the latest introduction of the broad DLP Pico family that powers today's most exciting and unique imaging products. "The new DLP Pico HD chipset provides the ultimate combination of the best image quality in the smallest size, and is poised to revolutionize the worlds of consumer entertainment and mobile enterprise solutions," said Frank Moizio, Manager, DLP Pico Projection. "Never again will mobile professionals be caught without the ability to share their vision, as this new chipset enables the brightest projection products that can be easily stored and carried in a laptop bag. Even more exciting is that it opens tremendous opportunities in the world of entertainment - from greater than 100-inch HD video from the palm of your hand - to a wide variety of new entertainment devices that allow consumers to enjoy big picture HD experiences in a snap, anywhere, anytime." Multiple manufacturers and brands will be at CES showing products with DLP Pico technology inside. Among them are Acer, Dell, LG, Optoma, and ViewSonic, who will be showing the first products based on the new HD chipset. Acer: "We are pleased to have the Acer brand associated with the best possible image quality for tiny projection products," said Chris White, Senior Director, Acer America Corporation, "and are thoroughly excited about being able to achieve the brightest LED DLP Pico projection product in the market." LG: "It is exciting to work together with DLP and their new HD chipset," said YE Kim, Projector Business Team Leader, LG Electronics. "With our new HW300T multimedia pocket projector with built-in TV tuner, we expect to maintain our leadership position through improvements in resolution and brightness, and a form factor that will best serve both the portable business and consumer entertainment environments." Optoma: "As a leading supplier of DLP-enabled products, Optoma is pleased to work with TI to create the ultimate image quality in small CE Pico products, for a state-of-the-art experience with tools for both portable entertainment, as well as personal business productivity," said Maggie Lu, Executive Vice President, Optoma Americas. ViewSonic: "We are excited to offer this truly unique HD product powered by the latest DLP Pico chipset," said Jeff Volpe, Vice President and General Manager, ViewSonic Americas. "Due to its compact size (easily fits into a notebook bag) and high brightness, we believe our PLED-W200 will be the ideal pocket projector for presenters on the go. Moreover, this product also serves as a high quality mobile entertainment product, so whether the user is viewing sporting events, TV, pictures, movies, or giving a presentation, it's all possible with our PLED-W200 DLP Pico projector." The latest DLP Pico chip and its siblings can be found at the heart of a growing number of all-new product types. To experience firsthand the full breadth of new and upcoming products equipped with Texas Instruments DLP Pico technology, along with other DLP innovations, be sure to check us out at the following CES 2011 events, and visit our partners' exhibits throughout the show floor: Pepcom's Digital Experience! – Wed. January 5th, 7pm PT (Caesars Palace) DLP Pico demo suite – January 6th – January 7th To access the latest news, images, and other digital content during CES about DLP Pico and other products from Texas Instruments, check out our online press kit at www.DLP.com/CES2011. You can also follow DLP on Twitter at @TI_DLP, and view videos on DLP's YouTube page, www.YouTube.com/DLPTechnology. For more information on DLP products, please visit www.DLP.com. About Texas Instruments DLP Products Since 1996, Texas Instruments' award-winning DLP display technology has powered the world's top projectors and displays, delivering pictures rich with color, contrast, clarity and brightness to screens of all sizes. DLP's technology spans movie theaters (DLP Cinema®) and large-scale, professional venues; in conference rooms, classrooms, and home theaters; and with DLP Pico™-enabled mobile devices, the ability to project images from the palm of your hand. Every DLP chip features an array of up to 2.2 million microscopic mirrors that switch at ultra high speeds – an innovative advantage that remains cutting edge and ideal for current and future applications alike. The results are high-resolution, highly reliable, razor-sharp images, that even work with fast motion video. To learn more about DLP technology, please visit www.DLP.com, or follow DLP on Twitter at www.Twitter.com/TI_DLP. About Texas Instruments Texas Instruments (NYSE: TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through design, sales and manufacturing operations in more than 30 countries. For more information, go to www.TI.com. SOURCE Texas Instruments DLP

 

TI's OMAP4440 processor boasts new upgrades, raises the bar for mobile design

WorldWideTech & Science. Francisco De Jesús.

Mobile video teleconferencing, stereoscopic-3D and gesture recognition capabilities gain from OMAP™ 4 technology upgrades, including speeds of 1.5 GHz per CPU core. Press Relase: DALLAS, Dec. 8, 2010 /PRNewswire/ -- Texas Instruments Incorporated (TI) (NYSE: TXN) today announced that the OMAP4440 applications processor enhancements deliver impressive performance improvements beyond the OMAP4430 processor, including a 1.25x increase in graphics performance, a 30 percent decrease in webpage load time, a 2x increase in 1080p video playback performance and clock speeds as fast as 1.5 GHz per ARM® Cortex™-A9 MPCore™. These marked performance advantages, along with other feature enhancements, reaffirm the OMAP™ 4 platform's ability to drive today's most coveted Smartphone and tablet user experiences, such as 1080p stereoscopic 3D (S3D), 1080p video conferencing and gesture recognition. For OMAP4440 processor details, visit: www.ti.com/omap4440. "The increased performance given by the OMAP4440 applications processor illustrates TI's ability to push mobile computing possibilities with the right processor architecture enveloped in the right platform," said Remi El-Ouazzane, vice president, OMAP platform business unit, TI. "We seized an opportunity to enhance the platform capabilities driving the OMAP4430 processor's success today. As OMAP4430 processor-based products hit the market in first half 2011, we're arming our customers with a huge performance boost via an easy migration to OMAP4440 processor for their next wave of exciting devices. The resulting user experiences will radically impact how consumers continue to integrate mobile technology into their daily lives." OMAP4440 processor: Primed for upgraded mobile user experiences The OMAP 4 platform is a highly-optimized system-on-chip (SOC) leveraging two ARM Cortex-A9 MPCore general-purpose processors, reaching speeds of 1.5 GHz per core, complemented by two ARM Cortex-M3 cores to power-efficiently offload time-critical and control tasks. High-performance multimedia capabilities are provided by programmable cores including a POWERVR™ 3D graphics engine, TI IVA 3 for high-definition/multi-standard video, TI image signal processor (ISP) for high-quality/high-megapixels imaging, TI low-power audio processor and TI digital signal processor(DSP) based on the TI C64x DSP for natural user interface and signal processing innovations optimized for mobile applications. The OMAP 4 platform efficiently supports concurrent, high-performance processing and high-definition multimedia with dual, high-bandwidth memory channels. The platform is secured with TI M-Shield™ security, and delivers high performance within the small power budget of mobile devices by leveraging TI SmartReflex™ power and performance management technologies. As the second member of the OMAP 4 product family, the OMAP4440 processor's upgraded features and benefits include: Feature* Benefit Two ARM® Cortex™-A9 MPCores™ optimized to 1.5 GHz each 50% increase in overall performance; 33% reduction in webpage load time End-to-end graphics acceleration enhancement (triangles per second, fill rate and shaders) 25% increase in overall graphics performance Support for HDMI v1.4 3D modes Full 1080p HD S3D playback to 3D TV 1080p60 video format support 2x higher performance video playback Support for up to two 12-megapixel cameras in parallel Higher stereoscopic resolution encode enabling stereo photography, which meets the same resolution previously experienced only with 2D photography IVA 3 multimedia hardware accelerator Industry's highest quality video playback at low bit rates Complete pin-to-pin hardware and software compatibility Easy migration from the OMAP4430 processors *Comparative data is relative to the OMAP4430 processor's performance The OMAP4440 processor is uniquely positioned to support the widely anticipated mobile video teleconferencing experience. For example, successful mobile video teleconferencing requires a few key components directly addressed by the following OMAP4440 processor features: Mobile video teleconferencing component OMAP4440 processor-enabled feature High-quality mobile video conferencing Improved video quality in low-light conditions; video stabilization Chat software (i.e., Skype or Google Talk) Video codec support includes H.264, VP7, H.263, SVC, and more Peer-to-peer (1 local user with one other user) chat functionality 1080p mobile video conferencing Multi-chat (1 local user with up to 4 other users) functionality 720p resolution with stereo audio support Cloud access for simultaneous application support (e.g., browsing the web while chatting or document sharing) Optimized symmetric multiprocessing architecture to deliver low latency and high bandwidth support Availability and pricing The OMAP4440 applications processor will sample in first quarter 2011, with production expected by the second half of 2011. These products are intended for high-volume wireless OEMs and ODMs and are not available through distributors. About Texas Instruments Texas Instruments (NYSE: TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through manufacturing, design and sales operations in more than 30 countries. For more information, go to www.ti.com. Trademarks OMAP is a trademark of Texas Instruments Inc. All registered trademarks and other trademarks belong to their respective owners. SOURCE Texas Instruments Incorporated

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Posted 8 Dec 2010 9:00 AM by NewsCenter

OMAP™ 4 Platform - OMAP4430/OMAP4440

Chip Block Diagram

Enlarge

OMAP™ 4 Key Benefits

• Designed to drive smart phones and Mobile Internet Devices (MIDs)
• IVA 3 hardware accelerators enable full HD 1080p, multi-standard video encode/decode
• Faster, higher-quality image and video capture with digital SLR-like imaging up to 20 megapixels
• Dual-core ARM® Cortex™-A9 MPCore™ with Symmetric Multiprocessing (SMP)
• Integrated POWERVR™ SGX540 graphics accelerator drives 3D gaming and 3D user interfaces
• Highly optimized mobile applications platform
• OMAP4430 operates at up to 1 GHz
• OMAP4440 operates at 1+ GHz

Feature	Allows
45-nm CMOS process	The highest levels of processor performance and lowest power consumption
Dual-core ARM Cortex-A9 MPCore with Symmetric Multiprocessing (SMP)	Higher mobile computing performance PC-like web browsing 150 percent performance increase versus previous ARM Cortex-A8 core Faster user interfaces and less power consumption SMP’s scalable performance activates only the cores that are needed for that particular process
IVA 3 multimedia accelerator	Full HD 1080p30 multi-standard video encode/decode Hardwired codecs deliver high performance at low power levels Programmable DSP provides flexibility for future codecs
Imagination Technologies’ POWERVR™ SGX540 graphics core	2x the sustained performance compared to the previous SGX530 core Compelling graphics interfaces Supports large screen sizes at higher frames per second while still consuming less power than previous cores Supports all the major APIs, including: OpenGL® ES v2.0, OpenGL ES v1.1, OpenVG v1.1 and EGL v1.3
Integrated Image Signal Processor	Enhanced image quality Faster system performance Reduced external components Lower system cost Lower system power
M-Shield™ mobile security technologyenhanced with ARM TrustZone support and based on open APIs	Content protection Transaction security Secure network access Secure flashing and booting Terminal identity protection Network lock protection
SmartReflex™ 2 technology	Advanced power reduction Dynamically controlled voltage, frequency and power based on device activity, modes of operation and temperature
TWL6030/6040 power management/audio codec companion devices support	Maximized battery life Boosted system performance Significantly reduced board space and system cost Efficiently managed energy and audio functionality
Low Power Audio	Provides up to 140+ hours of CD-quality audio playback
Comprehensive Software Suite	Faster time to market Lower R&D costs Ensures highest performance possible in customer’s handsets

Support Features:

• Composite TV output
• HDMI v1.3 output to drive HD displays
• Larger, color rich display support up to WUXGA (1920 x 1200)
• MIPI serial camera and serial display interfaces
• MIPI® SLIMbus^SM
• MMC/SD
• USB 2.0 On-The-Go High Speed
• Comprehensive software suite supporting all major mobile OSes that is fully integrated and tested for real-world use cases to reduce development time and costs
• OMAP Developer Network provides programs and media components for manufacturers to create distinctive products delivered to market quickly