Francisco De Jesùs.
New TriQuint MMPAs
with Envelope Tracking Capture Design Wins in Leading LTE Smartphones
The versatile, highly integrated modules not
only prolong battery life with new envelope tracking technology, but also simplify
complex RF design for multi-band smartphones with a new mobile chip interface used
by multiple chipset partners
TriQuint
Semiconductor, Inc , a leading RF solutions
supplier and technology innovator, today announced three new multi-mode, multi-band
power amplifier modules (MMPAs) that deliver longer battery life for LTE
smartphones while simplifying increasingly complex RF design. The versatile new
products, which are already capturing design wins in leading LTE smartphones, feature
new envelope tracking technology as well as a new mobile chip interface.
“Building on the success of TriQuint’s highly integrated TRIUMF™
MMPAs, our three newest products add more LTE bands to cover more regional
markets, as well as support for power-saving envelope tracking and a versatile new
MIPI interface,” said Sean Riley, Vice President of Mobile Products.
Device
manufacturers are adopting envelope tracking (ET) in next-generation
smartphones to maximize energy efficiency. ET extends battery life by dynamically
adjusting the supply voltage to the power amplifier (PA), in contrast to PAs
with conventional constant-supply voltage. TriQuint’s new MMPAs also feature a
new mobile chip interface — based on
an open “MIPI” standard — used by
several chipset providers to increase interoperability among vendors and reduce
development time and effort.
In
addition to designing ever more sophisticated devices, smartphone manufacturers
serving the global market must produce several regional variants of each model
to operate in carriers’ specific assigned spectrum. This is becoming more
challenging as numerous new LTE bands are allocated. The versatile design of
TriQuint‘s new MMPAs gives manufacturers a common platform to release new
products at a faster pace, while controlling design and manufacturing costs. They
support a growing number of popular 3G/4G bands for specific regions as well as
quad-band GSM/EDGE. By integrating more functionality into smaller form
factors, they simplify PCB routing, reduce BOM count and speed time to market.
Media Contact: Ann Jansen
Marketing Comms Manager
TriQuint Semiconductor,
Inc.
Tel: +1.503.615.9127
E-mail: ann.jansen@triquint.com
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