WorldWide Tech & Science. Francisco De Jesùs.
SK hynix Inc., the world's No. 2 chipmaker, said Thursday it has developed the world's first memory chip equipped with the Through Silicon Via (TSV) technology, significantly improving speed and efficiency.
The South Korean chipmaker said the high-bandwidth memory chip has a 128-gigabytes-per-second processing speed, which is four times faster than the GDDR5 chips, and can run on a relatively small power of 1.2 volts.
The latest product by SK hynix will also consume 40 percent less power, the company added.
Jointly developed with U.S.-based Advanced Micro Devices (AMD), the new product combines four 40 nanometer-class dynamic random access memory (DRAM) under the TSV technology, which allows the DRAMs to be connected with higher electrical efficiency.
SK hynix said the TSV-based chip can be applied to devices that require high graphic performance, and it can also be used in super computers and servers. It said the mass production of the cutting-edge chips will begin in the second half of 2014.
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